Journal Description
Micromachines
Micromachines
is a peer-reviewed, open access journal on the science and technology of small structures, devices and systems, published monthly online by MDPI.
- Open Access— free for readers, with article processing charges (APC) paid by authors or their institutions.
- High Visibility: indexed within Scopus, SCIE (Web of Science), PubMed, PMC, Ei Compendex, dblp, and other databases.
- Journal Rank: JCR - Q2 (Chemistry, Analytical) / CiteScore - Q2 (Mechanical Engineering)
- Rapid Publication: manuscripts are peer-reviewed and a first decision is provided to authors approximately 16.1 days after submission; acceptance to publication is undertaken in 1.9 days (median values for papers published in this journal in the second half of 2023).
- Recognition of Reviewers: reviewers who provide timely, thorough peer-review reports receive vouchers entitling them to a discount on the APC of their next publication in any MDPI journal, in appreciation of the work done.
- Testimonials: See what our editors and authors say about Micromachines.
Impact Factor:
3.4 (2022);
5-Year Impact Factor:
3.3 (2022)
Latest Articles
Integrated LSPR Biosensing Signal Processing Strategy and Visualization Implementation
Micromachines 2024, 15(5), 631; https://doi.org/10.3390/mi15050631 (registering DOI) - 8 May 2024
Abstract
The LSPR biosensor chip is a groundbreaking tool popular in laboratory settings for identifying disease markers. However, its use in clinical environments is not as widespread. One notable gap is the lack of a universal signal processing tool for LSPR biosensing. To escalate
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The LSPR biosensor chip is a groundbreaking tool popular in laboratory settings for identifying disease markers. However, its use in clinical environments is not as widespread. One notable gap is the lack of a universal signal processing tool for LSPR biosensing. To escalate its precision, there is an emerging need for software that not only optimizes signal processing but also incorporates self-verification functionalities within LSPR biochemical sensors. Enter the visual LSPR sensor software—an innovative platform that processes real-time transmission or reflection spectra. This advanced software adeptly captures the nuanced structural changes at the nanostructure interface prompted by environmental fluctuations. It diligently records and computes a suite of parameters, including the resonance wavelength shift, full width at half maximum, sensitivity, and quality factor. These features empower users to tailor processing algorithms for each data capture session. Transcending traditional instruments, this method accommodates a multitude of parameters and ensures robust result validation while tactfully navigating nanostructure morphology complexities. Forsaking third-party tool dependencies, the software tackles challenges of precision and cost-effectiveness head-on, heralding a significant leap forward in nanophotonics, especially for high-throughput LSPR biosensing applications. This user-centric innovation marks substantial progress in biochemical detection. It is designed to serve both researchers and practitioners in the field of nanophotonic sensing technology, simplifying complexity while enhancing reliability and efficiency.
Full article
Open AccessReview
Recent Advances in Microfluidic-Based Extracellular Vesicle Analysis
by
Jiming Chen, Meiyu Zheng, Qiaoling Xiao, Hui Wang, Caixing Chi, Tahui Lin, Yulin Wang, Xue Yi and Lin Zhu
Micromachines 2024, 15(5), 630; https://doi.org/10.3390/mi15050630 (registering DOI) - 8 May 2024
Abstract
Extracellular vesicles (EVs) serve as vital messengers, facilitating communication between cells, and exhibit tremendous potential in the diagnosis and treatment of diseases. However, conventional EV isolation methods are labor-intensive, and they harvest EVs with low purity and compromised recovery. In addition, the drawbacks,
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Extracellular vesicles (EVs) serve as vital messengers, facilitating communication between cells, and exhibit tremendous potential in the diagnosis and treatment of diseases. However, conventional EV isolation methods are labor-intensive, and they harvest EVs with low purity and compromised recovery. In addition, the drawbacks, such as the limited sensitivity and specificity of traditional EV analysis methods, hinder the application of EVs in clinical use. Therefore, it is urgent to develop effective and standardized methods for isolating and detecting EVs. Microfluidics technology is a powerful and rapidly developing technology that has been introduced as a potential solution for the above bottlenecks. It holds the advantages of high integration, short analysis time, and low consumption of samples and reagents. In this review, we summarize the traditional techniques alongside microfluidic-based methodologies for the isolation and detection of EVs. We emphasize the distinct advantages of microfluidic technology in enhancing the capture efficiency and precise targeting of extracellular vesicles (EVs). We also explore its analytical role in targeted detection. Furthermore, this review highlights the transformative impact of microfluidic technology on EV analysis, with the potential to achieve automated and high-throughput EV detection in clinical samples.
Full article
(This article belongs to the Special Issue Application of Microfluidic Technology in Bioengineering)
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Open AccessReview
Micro-Scale Particle Tracking: From Conventional to Data-Driven Methods
by
Haoyu Wang, Liu Hong and Leonardo P. Chamorro
Micromachines 2024, 15(5), 629; https://doi.org/10.3390/mi15050629 (registering DOI) - 8 May 2024
Abstract
Micro-scale positioning techniques have become essential in numerous engineering systems. In the field of fluid mechanics, particle tracking velocimetry (PTV) stands out as a key method for tracking individual particles and reconstructing flow fields. Here, we present an overview of the micro-scale particle
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Micro-scale positioning techniques have become essential in numerous engineering systems. In the field of fluid mechanics, particle tracking velocimetry (PTV) stands out as a key method for tracking individual particles and reconstructing flow fields. Here, we present an overview of the micro-scale particle tracking methodologies that are predominantly employed for particle detection and flow field reconstruction. It covers various methods, including conventional and data-driven techniques. The advanced techniques, which combine developments in microscopy, photography, image processing, computer vision, and artificial intelligence, are making significant strides and will greatly benefit a wide range of scientific and engineering fields.
Full article
(This article belongs to the Special Issue Advanced Micro-/Nano-Manipulation and Positioning Techniques)
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Open AccessArticle
A Soft Robot Tactile Finger Using Oxidation-Reduction Graphene–Polyurethane Conductive Sponge
by
Hangze Li, Chaolin Ma, Jinmiao Chen, Haojie Wang, Xiao Chen, Zhijing Li and Youzhi Zhang
Micromachines 2024, 15(5), 628; https://doi.org/10.3390/mi15050628 - 7 May 2024
Abstract
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Currently, intelligent robotics is supplanting traditional industrial applications. It extends to business, service and care industries, and other fields. Stable robot grasping is a necessary prerequisite for all kinds of complex application scenarios. Herein, we propose a method for preparing an elastic porous
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Currently, intelligent robotics is supplanting traditional industrial applications. It extends to business, service and care industries, and other fields. Stable robot grasping is a necessary prerequisite for all kinds of complex application scenarios. Herein, we propose a method for preparing an elastic porous material with adjustable conductivity, hardness, and elastic modulus. Based on this, we design a soft robot tactile fingertip that is gentle, highly sensitive, and has an adjustable range. It has excellent sensitivity (~1.089 kpa−1), fast response time (~35 ms), and measures minimum pressures up to 0.02 N and stability over 500 cycles. The baseline capacitance of a sensor of the same size can be increased by a factor of 5–6, and graphene adheres better to polyurethane sponge and has good shock absorption. In addition, we demonstrated the application of the tactile fingertip to a two-finger manipulator to achieve stable grasping. In this paper, we demonstrate the great potential of the soft robot tactile finger in the field of adaptive grasping for intelligent robots.
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Graphical abstract
Open AccessArticle
Experimental Investigation on Ultra-Thin Vapor Chamber with Composite Wick for Electronics Thermal Management
by
Shiwei Zhang, Haoyi Huang, Jingjing Bai, Caiman Yan, Huarong Qiu, Yong Tang and Fangqiong Luo
Micromachines 2024, 15(5), 627; https://doi.org/10.3390/mi15050627 - 7 May 2024
Abstract
Ultra-thin vapor chambers (UTVCs) are widely used to cool high-power electronics due to their excellent thermal conductivity. In this study, a UTVC of 82 mm × 58 mm × 0.39 mm with composite wick was prepared. The composite wick is composed of two
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Ultra-thin vapor chambers (UTVCs) are widely used to cool high-power electronics due to their excellent thermal conductivity. In this study, a UTVC of 82 mm × 58 mm × 0.39 mm with composite wick was prepared. The composite wick is composed of two layers of copper mesh and multiple spiral-woven meshes (SWMs), and the composite wick was applied in UTVC to improve liquid replenishment performance and temperature uniformity. Furthermore, the thermal performance of UTVCs with different support column diameters, filling ratios (FRs), and SWM structures was experimentally studied. The results found that the equivalent thermal conductivity (ETC) decreases as the diameter of the support column increases; the UTVC with 0.5 mm support column diameter has the highest ETC, at 3473 W/(m·K). Then, the effect of FR on the heat transfer performance of UTVCs with SWM numbers of 0, 1, 2, and 3 (0 SWMs, 1 SWM, 2 SWMs, 3 SWMs) is consistent, the 30% FR UTVC with 3 SWMs having the highest ETC, at 3837 W/(m·K). Finally, the increased number of SWMs can significantly improve the ultimate power of the UTVCs, the UTVC with 3 SWMs having the highest ultimate power, at 26 W. The above experimental studies indicate that the designed and manufactured UTVCs have great potential advantages in thermal dissipation for electronics.
Full article
Open AccessReview
Progress in Research on White Organic Light-Emitting Diodes Based on Ultrathin Emitting Layers
by
Wencheng Zhao, Xiaolin Hu, Fankang Kong, Jihua Tang, Duxv Yan, Jintao Wang, Yuru Liu, Yuanping Sun, Ren Sheng and Ping Chen
Micromachines 2024, 15(5), 626; https://doi.org/10.3390/mi15050626 - 7 May 2024
Abstract
White organic light-emitting diodes (WOLEDs) hold vast prospects in the fields of next-generation displays and solid-state lighting. Ultrathin emitting layers (UEMLs) have become a research hotspot because of their unique advantage. On the basis of simplifying the device structure and preparation process, they
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White organic light-emitting diodes (WOLEDs) hold vast prospects in the fields of next-generation displays and solid-state lighting. Ultrathin emitting layers (UEMLs) have become a research hotspot because of their unique advantage. On the basis of simplifying the device structure and preparation process, they can achieve electroluminescent performance comparable to that of doped devices. In this review, we first discuss the working principles and advantages of WOLEDs based on UEML architecture, which can achieve low cost and more flexibility by simplifying the device structure and preparation process. Subsequently, the successful applications of doping and non-doping technologies in fluorescent, phosphorescent, and hybrid WOLEDs combined with UEMLs are discussed, and the operation mechanisms of these WOLEDs are emphasized briefly. We firmly believe that this article will bring new hope for the development of UEML-based WOLEDs in the future.
Full article
Open AccessReview
Underground Ink: Printed Electronics Enabling Electrochemical Sensing in Soil
by
Kuan-Yu Chen, Jeneel Kachhadiya, Sharar Muhtasim, Shuohao Cai, Jingyi Huang and Joseph Andrews
Micromachines 2024, 15(5), 625; https://doi.org/10.3390/mi15050625 - 7 May 2024
Abstract
Improving agricultural production relies on the decisions and actions of farmers and land managers, highlighting the importance of efficient soil monitoring techniques for better resource management and reduced environmental impacts. Despite considerable advancements in soil sensors, their traditional bulky counterparts cause difficulty in
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Improving agricultural production relies on the decisions and actions of farmers and land managers, highlighting the importance of efficient soil monitoring techniques for better resource management and reduced environmental impacts. Despite considerable advancements in soil sensors, their traditional bulky counterparts cause difficulty in widespread adoption and large-scale deployment. Printed electronics emerge as a promising technology, offering flexibility in device design, cost-effectiveness for mass production, and a compact footprint suitable for versatile deployment platforms. This review overviews how printed sensors are used in monitoring soil parameters through electrochemical sensing mechanisms, enabling direct measurement of nutrients, moisture content, pH value, and others. Notably, printed sensors address scalability and cost concerns in fabrication, making them suitable for deployment across large crop fields. Additionally, seamlessly integrating printed sensors with printed antenna units or traditional integrated circuits can facilitate comprehensive functionality for real-time data collection and communication. This real-time information empowers informed decision-making, optimizes resource management, and enhances crop yield. This review aims to provide a comprehensive overview of recent work related to printed electrochemical soil sensors, ultimately providing insight into future research directions that can enable widespread adoption of precision agriculture technologies.
Full article
(This article belongs to the Special Issue Electrochemistry Applications in Energy and Environment: Battery, Sensors and Other Technologies)
Open AccessCommunication
An AlScN Piezoelectric Micromechanical Ultrasonic Transducer-Based Power-Harvesting Device for Wireless Power Transmission
by
Junxiang Li, Yunfei Gao, Zhixin Zhou, Qiang Ping, Lei Qiu and Liang Lou
Micromachines 2024, 15(5), 624; https://doi.org/10.3390/mi15050624 - 6 May 2024
Abstract
Ultrasonic wireless power transfer technology (UWPT) represents a key technology employed for energizing implantable medical devices (IMDs). In recent years, aluminum nitride (AlN) has gained significant attention due to its biocompatibility and compatibility with complementary metal-oxide-semiconductor (CMOS) technology. In the meantime, the integration
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Ultrasonic wireless power transfer technology (UWPT) represents a key technology employed for energizing implantable medical devices (IMDs). In recent years, aluminum nitride (AlN) has gained significant attention due to its biocompatibility and compatibility with complementary metal-oxide-semiconductor (CMOS) technology. In the meantime, the integration of scandium-doped aluminum nitride (Al90.4%Sc9.6%N) is an effective solution to address the sensitivity limitations of AlN material for both receiving and transmission capabilities. This study focuses on developing a miniaturized UWPT receiver device based on AlScN piezoelectric micro-electromechanical transducers (PMUTs). The proposed receiver features a PMUT array of 2.8 × 2.8 mm2 comprising 13 × 13 square elements. An acoustic matching gel is applied to address acoustic impedance mismatch when operating in liquid environments. Experimental evaluations in deionized water demonstrated that the power transfer efficiency (PTE) is up to 2.33%. The back-end signal processing circuitry includes voltage-doubling rectification, energy storage, and voltage regulation conversion sections, which effectively transform the generated AC signal into a stable 3.3 V DC voltage output and successfully light a commercial LED. This research extends the scope of wireless charging applications and paves the way for further device miniaturization by integrating all system components into a single chip in future implementations.
Full article
(This article belongs to the Special Issue Acoustic Transducers and Their Applications)
Open AccessArticle
Structure Design and Heat Transfer Performance Analysis of a Novel Composite Phase Change Active Cooling Channel Wall for Hypersonic Aircraft
by
Weichen Li, Jieliang Zhao, Xiangbing Wu, Lulu Liang, Wenzhong Wang and Shaoze Yan
Micromachines 2024, 15(5), 623; https://doi.org/10.3390/mi15050623 - 6 May 2024
Abstract
Efficient and stable heat dissipation structure is crucial for improving the convective heat transfer performance of thermal protection systems (TPSs) for hypersonic aircraft. However, the heat dissipation wall of the current TPS is limited by a single material and structure, inefficiently dissipating the
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Efficient and stable heat dissipation structure is crucial for improving the convective heat transfer performance of thermal protection systems (TPSs) for hypersonic aircraft. However, the heat dissipation wall of the current TPS is limited by a single material and structure, inefficiently dissipating the large amount of accumulated heat generated during the high-speed maneuvering flight of hypersonic aircraft. Here, a convection cooling channel structure of TPS is proposed, which is an innovative multi-level structure inspired by the natural honeycomb. An active cooling channel (PCM-HC) is designed by using a variable-density topology optimization method and filled with phase change material (PCM). Numerical simulations are used to investigate the thermal performance of the PCM-HC wall, focusing on the influence of PCM properties, structural geometric parameters, and PCM types on heat transfer characteristics. The results demonstrate that the honeycomb-like convection cooling channel wall, combined with PCM latent heat of phase change, exhibits superior heat dissipation capability. With a heat flux input of 50 kW/m2, the maximum temperature on the inner wall of PCM-HC is reduced by 12 K to 20 K. Different PCMs have opposing effects on heat transfer performance due to their distinct thermophysical properties. This work can provide a theoretical basis for the design of high-efficiency cooling channel, improving the heat dissipation performance in the TPS of hypersonic aircraft.
Full article
(This article belongs to the Special Issue Heat Transfer and Fluid Flow in Microstructures)
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Open AccessArticle
From Formulation to Application: Effects of Plasticizer on the Printability of Fluoro Elastomer Compounds and Additive Manufacturing of Specialized Seals
by
Mookkan Periyasamy, AA Mubasshir, Stiven Kodra, Sangeetham Chandramouli, Ronald Campbell, David O. Kazmer and Joey L. Mead
Micromachines 2024, 15(5), 622; https://doi.org/10.3390/mi15050622 - 5 May 2024
Abstract
This work investigated material extrusion additive manufacturing (MatEx AM) of specialized fluoroelastomer (FKM) compounds for applications in rubber seals and gaskets. The influence of a commercially available perfluoropolyether (PFPE) plasticizer on the printability of a control FKM rubber compound was studied using a
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This work investigated material extrusion additive manufacturing (MatEx AM) of specialized fluoroelastomer (FKM) compounds for applications in rubber seals and gaskets. The influence of a commercially available perfluoropolyether (PFPE) plasticizer on the printability of a control FKM rubber compound was studied using a custom-designed ram material extruder, Additive Ram Material Extruder (ARME), for printing fully compounded thermoset elastomers. The plasticizer’s effectiveness was assessed based on its ability to address challenges such as high compound viscosity and post-print shrinkage, as well as its impact on interlayer adhesion. The addition of the PFPE plasticizer significantly reduced the FKM compound’s viscosity (by 70%) and post-print shrinkage (by 65%). While the addition of the plasticizer decreased the tensile strength of the control compound, specimens printed with the plasticized FKM retained 34% of the tensile strength of compression-molded samples, compared to only 23% for the unplasticized compound. Finally, the feasibility of seals and gaskets manufacturing using both conventional and unconventional additive manufacturing (AM) approaches was explored. A hybrid method combining AM and soft tooling for compression molding emerged as the optimal method for seal and gasket fabrication.
Full article
(This article belongs to the Special Issue Advanced Additive Manufacturing Techniques: From Fundamental Research to Applications)
Open AccessCommunication
Influence of Surface Treatments on Urea Detection Using Si Electrolyte-Gated Transistors with Different Gate Electrodes
by
Wonyeong Choi, Seonghwan Shin, Jeonghyeon Do, Jongmin Son, Kihyun Kim and Jeong-Soo Lee
Micromachines 2024, 15(5), 621; https://doi.org/10.3390/mi15050621 - 5 May 2024
Abstract
We investigated the impact of surface treatments on Si-based electrolyte-gated transistors (EGTs) for detecting urea. Three types of EGTs were fabricated with distinct gate electrodes (Ag, Au, Pt) using a top-down method. These EGTs exhibited exceptional intrinsic electrical properties, including a low subthreshold
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We investigated the impact of surface treatments on Si-based electrolyte-gated transistors (EGTs) for detecting urea. Three types of EGTs were fabricated with distinct gate electrodes (Ag, Au, Pt) using a top-down method. These EGTs exhibited exceptional intrinsic electrical properties, including a low subthreshold swing of 80 mV/dec, a high on/off current ratio of 106, and negligible hysteresis. Three surface treatment methods ((3-amino-propyl) triethoxysilane (APTES) and glutaraldehyde (GA), 11-mercaptoundecanoic acid (11-MUA), 3-mercaptopropionic acid (3-MPA)) were individually applied to the EGTs with different gate electrodes (Ag, Au, Pt). Gold nanoparticle binding tests were performed to validate the surface functionalization. We compared their detection performance of urea and found that APTES and GA exhibited the most superior detection characteristics, followed by 11-MUA and 3-MPA, regardless of the gate metal. APTES and GA, with the highest pKa among the three surface treatment methods, did not compromise the activity of urease, making it the most suitable surface treatment method for urea sensing.
Full article
(This article belongs to the Special Issue CMOS Biosensor and Bioelectronic)
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Open AccessArticle
ANN-Based LiDAR Positioning System for B5G
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Egidio Raimundo Neto, Matheus Ferreira Silva, Tomás P. V. Andrade and Arismar Cerqueira Sodré Junior
Micromachines 2024, 15(5), 620; https://doi.org/10.3390/mi15050620 - 4 May 2024
Abstract
This work reports the development of an efficient and precise indoor positioning system utilizing two-dimensional (2D) light detection and ranging (LiDAR) technology, aiming to address the challenging sensing and positioning requirements of the beyond fifth-generation (B5G) mobile networks. The core of this work
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This work reports the development of an efficient and precise indoor positioning system utilizing two-dimensional (2D) light detection and ranging (LiDAR) technology, aiming to address the challenging sensing and positioning requirements of the beyond fifth-generation (B5G) mobile networks. The core of this work is the implementation of a 2D-LiDAR system enhanced by an artificial neural network (ANN), chosen due to its robustness against electromagnetic interference and higher accuracy over traditional radiofrequency signal-based methods. The proposed system uses 2D-LiDAR sensors for data acquisition and digital filters for signal improvement. Moreover, a camera and an image-processing algorithm are used to automate the labeling of samples that will be used to train the ANN by means of indicating the regions where the pedestrians are positioned. This accurate positioning information is essential for the optimization of B5G network operation, including the control of antenna arrays and reconfigurable intelligent surfaces (RIS). The experimental validation demonstrates the efficiency of mapping pedestrian locations with a precision of up to 98.787%, accuracy of 95.25%, recall of 98.537%, and an F1 score of 98.571%. These results show that the proposed system has the potential to solve the problem of sensing and positioning in indoor environments with high reliability and accuracy.
Full article
(This article belongs to the Special Issue Selected Papers from the 20th SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC 2023))
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Open AccessArticle
Capillary Force-Driven Quantitative Plasma Separation Method for Application of Whole Blood Detection Microfluidic Chip
by
Xiaohua Fang, Cuimin Sun, Peng Dai, Zhaokun Xian, Wenyun Su, Chaowen Zheng, Dong Xing, Xiaotian Xu and Hui You
Micromachines 2024, 15(5), 619; https://doi.org/10.3390/mi15050619 - 1 May 2024
Abstract
Separating plasma or serum from blood is essential for precise testing. However, extracting precise plasma quantities outside the laboratory poses challenges. A recent study has introduced a capillary force-driven membrane filtration technique to accurately separate small plasma volumes. This method efficiently isolates 100–200
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Separating plasma or serum from blood is essential for precise testing. However, extracting precise plasma quantities outside the laboratory poses challenges. A recent study has introduced a capillary force-driven membrane filtration technique to accurately separate small plasma volumes. This method efficiently isolates 100–200 L of pure human whole blood with a 48% hematocrit, resulting in 5–30 L of plasma with less than a 10% margin of error. The entire process is completed within 20 min, offering a simple and cost-effective approach to blood separation. This study has successfully addressed the bottleneck in self-service POCT, ensuring testing accuracy. This innovative method shows promise for clinical diagnostics and point-of-care testing.
Full article
(This article belongs to the Special Issue Recent Advances in Lab-on-a-Chip and Their Biomedical Applications)
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Open AccessArticle
An Experimental Investigation of R600a Condensation in a Multiport Microchannel
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Burak Çoban and Lütfullah Kuddusi
Micromachines 2024, 15(5), 618; https://doi.org/10.3390/mi15050618 - 1 May 2024
Abstract
This study aims to provide condensation heat transfer coefficients of R600a (isobutane) refrigerant under mass fluxes between 50 and 98 kg/m2·s at saturation temperatures of 35 °C, 40 °C and 45 °C. Additionally, experiments are conducted with varying inlet vapour quality
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This study aims to provide condensation heat transfer coefficients of R600a (isobutane) refrigerant under mass fluxes between 50 and 98 kg/m2·s at saturation temperatures of 35 °C, 40 °C and 45 °C. Additionally, experiments are conducted with varying inlet vapour quality to understand its effect on the condensation heat transfer measurement. An aluminium multiport microchannel with a hydraulic diameter () of 0.399 mm is used, where a plexiglass cover is mounted on the top of the microchannels to observe the flow conditions. A 1D heat transfer through the aluminium block is assumed, and heat flux through the refrigerant to the coolant is measured to obtain condensation heat transfer coefficients of R600a. The results showed that decreasing saturation temperature and increasing vapour quality increase the condensation heat transfer coefficient. Increasing refrigerant mass flux increases the heat transfer coefficient up to a specific mass flux. It is observed that the effect of inlet vapour quality becomes significant as introduced quality decreases due to increasing fluctuation.
Full article
Open AccessArticle
Temperature-Decoupled Single-Crystal MgO Fiber-Optic Fabry–Perot Vibration Sensor Based on MEMS Technology for Harsh Environments
by
Chengxin Su, Pinggang Jia, Aihao Zhao, Jiacheng Tu, Jia Liu, Qianyu Ren and Jijun Xiong
Micromachines 2024, 15(5), 616; https://doi.org/10.3390/mi15050616 (registering DOI) - 1 May 2024
Abstract
A high-temperature-resistance single-crystal magnesium oxide (MgO) extrinsic Fabry–Perot (FP) interferometer (EFPI) fiber-optic vibration sensor is proposed and experimentally demonstrated at 1000 °C. Due to the excellent thermal properties (melting point > 2800 °C) and optical properties (transmittance ≥ 90%), MgO is chosen as
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A high-temperature-resistance single-crystal magnesium oxide (MgO) extrinsic Fabry–Perot (FP) interferometer (EFPI) fiber-optic vibration sensor is proposed and experimentally demonstrated at 1000 °C. Due to the excellent thermal properties (melting point > 2800 °C) and optical properties (transmittance ≥ 90%), MgO is chosen as the ideal material to be placed in the high-temperature testing area. The combination of wet chemical etching and direct bonding is used to construct an all-MgO sensor head, which is favorable to reduce the temperature gradient inside the sensor structure and avoid sensor failure. A temperature decoupling method is proposed to eliminate the cross-sensitivity between temperature and vibration, improving the accuracy of vibration detection. The experimental results show that the sensor is stable at 20–1000 °C and 2–20 g, with a sensitivity of 0.0073 rad (20 °C). The maximum nonlinearity error of the vibration sensor measurement after temperature decoupling is 1.17%. The sensor with a high temperature resistance and outstanding dynamic performance has the potential for applications in testing aero-engines and gas turbine engines.
Full article
(This article belongs to the Special Issue Micro/Nano Sensors: Fabrication and Applications)
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Open AccessArticle
DAM SRAM CORE: An Efficient High-Speed and Low-Power CIM SRAM CORE Design for Feature Extraction Convolutional Layers in Binary Neural Networks
by
Ruiyong Zhao, Zhenghui Gong, Yulan Liu and Jing Chen
Micromachines 2024, 15(5), 617; https://doi.org/10.3390/mi15050617 - 30 Apr 2024
Abstract
This article proposes a novel design for an in-memory computing SRAM, the DAM SRAM CORE, which integrates storage and computational functionality within a unified 11T SRAM cell and enables the performance of large-scale parallel Multiply–Accumulate (MAC) operations within the SRAM array. This design
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This article proposes a novel design for an in-memory computing SRAM, the DAM SRAM CORE, which integrates storage and computational functionality within a unified 11T SRAM cell and enables the performance of large-scale parallel Multiply–Accumulate (MAC) operations within the SRAM array. This design not only improves the area efficiency of the individual cells but also realizes a compact layout. A key highlight of this design is its employment of a dynamic aXNOR-based computation mode, which significantly reduces the consumption of both dynamic and static power during the computational process within the array. Additionally, the design innovatively incorporates a self-stabilizing voltage gradient quantization circuit, which enhances the computational accuracy of the overall system. The 64 × 64 bit DAM SRAM CORE in-memory computing core was fabricated using the 55 nm CMOS logic process and validated via simulations. The experimental results show that this core can deliver 5-bit output results with 1-bit input feature data and 1-bit weight data, while maintaining a static power consumption of 0.48 mW/mm2 and a computational power consumption of 11.367 mW/mm2. This showcases its excellent low-power characteristics. Furthermore, the core achieves a data throughput of 109.75 GOPS and exhibits an impressive energy efficiency of 21.95 TOPS/W, which robustly validate the effectiveness and advanced nature of the proposed in-memory computing core design.
Full article
(This article belongs to the Special Issue Emerging Memory Materials and Devices)
Open AccessArticle
Dimension Prediction and Microstructure Study of Wire Arc Additive Manufactured 316L Stainless Steel Based on Artificial Neural Network and Finite Element Simulation
by
Yanyan Di, Zhizhen Zheng, Shengyong Pang, Jianjun Li and Yang Zhong
Micromachines 2024, 15(5), 615; https://doi.org/10.3390/mi15050615 - 30 Apr 2024
Abstract
The dimensional accuracy and microstructure affect the service performance of parts fabricated by wire arc additive manufacturing (WAAM). Regulating the geometry and microstructure of such parts presents a challenge. The coupling method of an artificial neural network and finite element (FE) is proposed
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The dimensional accuracy and microstructure affect the service performance of parts fabricated by wire arc additive manufacturing (WAAM). Regulating the geometry and microstructure of such parts presents a challenge. The coupling method of an artificial neural network and finite element (FE) is proposed in this research for this purpose. Back-propagating neural networks (BPNN) based on optimization algorithms were established to predict the bead width (BW) and height (BH) of the deposited layers. Then, the bead geometry was modeled based on the predicted dimension, and 3D FE heat transfer simulation was performed to investigate the evolution of temperature and microstructure. The results showed that the errors in BW and BH were less than 6%, and the beetle antenna search BPNN model had the highest prediction accuracy compared to the other models. The simulated melt pool error was less than 5% with the experimental results. The decrease in the ratio of the temperature gradient and solidification rate induced the transition of solidified grains from cellular crystals to columnar dendrites and then to equiaxed dendrites. Accelerating the cooling rate increased the primary dendrite arm spacing and δ-ferrite content. These results indicate that the coupling model provides a pathway for regulating the dimensions and microstructures of manufactured parts.
Full article
Open AccessArticle
Investigation on the Deformation and Surface Quality of a Bearing Outer Ring during Grinding Processing
by
Jiang Guo, Pengyu Long, Yong Zhao, Haojie Xu, Zhaoyuan Yang, Jianjun Wang, Tingting Li and Jiwu Tang
Micromachines 2024, 15(5), 614; https://doi.org/10.3390/mi15050614 - 30 Apr 2024
Abstract
Thin-walled bearings are widely used owing to the advantages of their light structure, high hardness, and strong load-carrying capacity. However, thin-walled bearings are often prone to deformation during the machining process, which can seriously affect the performance of the bearings. In addition, the
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Thin-walled bearings are widely used owing to the advantages of their light structure, high hardness, and strong load-carrying capacity. However, thin-walled bearings are often prone to deformation during the machining process, which can seriously affect the performance of the bearings. In addition, the machining deformation and quality of bearings are difficult to balance. To address the above issues, this paper investigates the effects of the machining parameters on the machining deformation, surface quality, and machining efficiency of a thin-walled bearing during the roughing stage. The dynamic balance between deformation inhibition and high quality in rough grinding was studied, and the optimal parameters for thin-walled bearing outer ring grinding were obtained. The deformation mechanism of thin-walled bearings caused by grinding was revealed through simulation and experimental analysis. The results show that the machining deformation and quality reach a balance when the workpiece speed is 55 r/min, the grinding wheel rotational speed is 2000 r/min, and the feed rate is 0.1 mm/min. Deformation increases with the increase in workpiece speed and grinding wheel speed. At the same time, the surface roughness increases with the increase in the workpiece speed, but the increase in the wheel speed will improve the surface roughness. As the workpiece speed increases, the surface topography shows a more pronounced stockpile of material, which is ameliorated by an increase in grinding wheel speed. As the rotational speed of the workpiece increases, the number of abrasive grains involved in the process per unit of time decreases, and the surface removal of the workpiece is less effective, while the increase in the rotational speed of the grinding wheel has the opposite effect. The grinding deformation of thin-walled bearings is mainly induced by machining heat and stress. As the rotational speed increases, the heat flux in the grinding zone increases. More heat flux flows into the surface of the workpiece, causing an increase in thermal stresses on the inner surface of the bearing collar, leading to greater deformation. The temperature in the grinding area can be reduced during machining, realizing a reduction in deformation. The research content contributes to the balance between high quality and low distortion in machining processes.
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(This article belongs to the Section D:Materials and Processing)
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Open AccessArticle
Enhancement of Convection and Molecular Transport into Film Stacked Structures by Introduction of Notch Shape for Micro-Immunoassay
by
Daiki Arai, Satoshi Ogata, Tetsuhide Shimizu and Ming Yang
Micromachines 2024, 15(5), 613; https://doi.org/10.3390/mi15050613 - 30 Apr 2024
Abstract
A 3D-stack microfluidic device that can be used in combination with 96-well plates for micro-immunoassay was developed by the authors. ELISA for detecting IgA by the 3D-stack can be performed in one-ninth of the time of the conventional method by using only 96-well
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A 3D-stack microfluidic device that can be used in combination with 96-well plates for micro-immunoassay was developed by the authors. ELISA for detecting IgA by the 3D-stack can be performed in one-ninth of the time of the conventional method by using only 96-well plates. In this study, a notched-shape film was designed and utilized for the 3D-stack to promote circulation by enhancing and utilizing the axial flow and circumferential flow in order to further reduce the reaction time. A finite element analysis was performed to evaluate the axial flow and circumferential flow while using the 3D-stack in a well and design the optimal shape. The 3D-stack with the notched-shape film was fabricated and utilized for the binding rate test of the antibody and antigen and ELISA. As a result, by promoting circulation using 3D-stack with notched-shape film, the reaction time for each process of ELISA was reduced to 1 min, which is 1/60 for 96 wells at low concentrations.
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(This article belongs to the Special Issue Recent Progress of Lab-on-a-Chip Assays)
Open AccessArticle
Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections
by
Nana Ren, Yuyi Zhang, Wenlong Shu, Chenxiao Lu, Wenjing Zhang, Zhuo Chen and Fuliang Wang
Micromachines 2024, 15(5), 612; https://doi.org/10.3390/mi15050612 - 30 Apr 2024
Abstract
Three-dimensional (3D) integration has become a leading approach in chip packaging. The interconnection density and reliability of micro-bumps in chip stacking are often threatened by high bonding temperatures. The method of building chip-to-chip interconnections by electroless deposition of metal has its distinct merit,
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Three-dimensional (3D) integration has become a leading approach in chip packaging. The interconnection density and reliability of micro-bumps in chip stacking are often threatened by high bonding temperatures. The method of building chip-to-chip interconnections by electroless deposition of metal has its distinct merit, while the interfacial defect issue, especially that related to voiding during the merging of opposite sides, remains largely unsolved. In this study, to trace the influencing factors in the voiding, the growth characteristics of the electroless all-copper interconnections were examined by carrying out deposition experiments in a microfluidic channel device. The results show that when the gap between the opposite copper bumps to be electrolessly merged is as low as 10 μm, significant voids appear at the inflow side and the top of the copper bumps because the hydrogen cannot be expelled in time. A finite-element flow model of the plating solution between the chips was established, which showed that the flow rate of the plating solution around the copper bumps was much higher than in the merging gap, causing an uneven supply of reactants. Based on these findings, we proposed two potential solutions, one is to improve the flow mode of the plating solution, and the other is to add the reaction inhibitor, 2,2′-bipyridine. Finally, the combination of these two approaches successfully achieved an improved merging quality of the copper joints.
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(This article belongs to the Section E:Engineering and Technology)
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