Photonic Integration: Recent Advances and Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Optics and Lasers".

Deadline for manuscript submissions: closed (31 October 2018) | Viewed by 10806

Special Issue Editors


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Guest Editor
School of Physics, University of Sydney, Sydney, NSW 2050, Australia
Interests: integrated optics; on-chip lasers; photon–phonon interactions; mode-locked lasers; microwave photonics; optical frequency combs

E-Mail Website
Guest Editor
School of Physics, University of Sydney, Sydney, NSW 2050, Australia
Interests: integrated optics; integrated microwave photonics; nonlinear optics; optical signal processing; microwave engineering; antennas

E-Mail Website
Guest Editor
ETH Zurich, Institute of Electromagnetic Fields (IEF), Gloriastrasse 35, 8092 Zurich, Switzerland
Interests: microwave photonics; microwave and all-optical signal processing; wireless communications; antennas; plasmonics; electronics–photonics integration

Special Issue Information

Dear Colleagues,

It is our pleasure to invite you to contribute to the upcoming Special Issue on “Photonic Integration in Applied Sciences”. Relevant submissions presenting exciting results (experimental or theoretical) either as short letters or full-length papers are welcome. We will also be soliciting thorough reviews of important results already published.

The idea of manipulating photons on a chip-scale device was proposed more than 50 years ago, however recent advances such as ultra-low loss waveguides, heterogeneous integration, on-chip frequency combs and novel modulators has brought photonic integrated circuits closer to widespread commercial deployment. The field of photonic integration is rapidly evolving due to the development of new on-chip functionalities for a wide range of applications, newly emerging material platforms for active and passive devices, and new concepts for photon manipulation for example through the plasmonic effect or the Brillouin scattering effect.

This issue aims to capture the major breakthroughs in the areas of (but not limited to):

  • Electronically and optically-reconfigurable photonic devices
  • Novel on-chip modulators
  • 2D and 3D photonic integration, including heterogeneous integration and laser written waveguides
  • Electronics-photonics co-integration
  • Design of novel integrated optical circuits
  • Applications of integrated photonics including integrated microwave photonics, on-chip optical signal processing, quantum optics, mid-IR, sensing
  • On-chip lasers including semiconductor lasers and rare-earth and transition-metal doped solid-state lasers
  • Silicon-based photonics and plasmonics
  • Integrated nonlinear optics
  • On-chip frequency combs and supercontinuum sources

SI Best paper award (300 CHF, a certificate and a free publication opportunity for next submission to Applied Sciences) will be selected from this special issue by an evaluation panel consisting of the editors and leading-experts in the field.

Dr. Amol Choudhary
Dr. David Marpaung
Dr. Maurizio Burla
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  1. integrated optics
  2. on-chip lasers
  3. integrated microwave photonics
  4. plasmonics
  5. heterogeneous integration
  6. optical frequency combs
  7. silicon photonics
  8. nonlinear optics
  9. optical signal processing
  10. low-loss waveguides

Published Papers (1 paper)

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Research

22 pages, 2744 KiB  
Article
Grating-Assisted Fiber to Chip Coupling for SOI Photonic Circuits
by Siddharth Nambiar, Purnima Sethi and Shankar Kumar Selvaraja
Appl. Sci. 2018, 8(7), 1142; https://doi.org/10.3390/app8071142 - 13 Jul 2018
Cited by 41 | Viewed by 10199
Abstract
Fiber to chip coupling is a critical aspect of any integrated photonic circuit. In terms of ease of fabrication as well as wafer-scale testability, surface grating couplers are by far the most preferred scheme of the coupling to integrated circuits. In the past [...] Read more.
Fiber to chip coupling is a critical aspect of any integrated photonic circuit. In terms of ease of fabrication as well as wafer-scale testability, surface grating couplers are by far the most preferred scheme of the coupling to integrated circuits. In the past decade, considerable effort has been made for designing efficient grating couplers on Silicon-on-Insulator (SOI) and other allied photonic platforms. Highly efficient grating couplers with sub-dB coupling performance have now been demonstrated. In this article, we review the recent advances made to develop grating coupler designs for a variety of applications on SOI platform. We begin with a basic overview of design methodology involving both shallow etched gratings and the emerging field of subwavelength gratings. The feasibility of reducing footprint by way of incorporating compact tapers is also explored. We also discuss novel grating designs like polarization diversity as well as dual band couplers. Lastly, a brief description of various packaging and wafer-scale testing schemes available for fiber-chip couplers is elaborated. Full article
(This article belongs to the Special Issue Photonic Integration: Recent Advances and Applications)
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