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Select Papers from the 21st European Microelectronics and Packaging Conference and Exhibition—EMPC 2017

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A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: closed (31 January 2018) | Viewed by 13904

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Special Issue Editors

Dr. Piotr Jasinski

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Guest Editor

Gdańsk University of Technology
Interests: sensors; solid oxide fuel cells; electrolyzers

Prof. Dr. Andrzej Dziedzic

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Guest Editor

Faculty of Electronics, Photonics and Microsystems, Wrocław University of Science and Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
Interests: microelectronic technologies—thick-film technology, thin-film technology, LTCC (Low Temperature Co-fired Ceramics); passive components; thermoelectricity; thermoelectric microgenerators; physical and chemical sensors; microsystems

Special Issue Information

Dear Colleagues,

The 21st European Microelectronics and Packaging Conference and Exhibition (EMPC 2017) will be held in Warsaw, Poland, 10–13 September, 2017, and will be devoted to recent developments in the field of microelectronics and packaging technologies, including 3D Integration, Surface Mounted Technology, Chip-on-Board and Flip-Chip Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, Micro-Electro-Mechanical Systems, Photonics, High-Frequency, High-Temperature and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management, Modelling/Design/Simulation, Reliability and Functional Systems. The advances in these fields are driven by increasing demand for high-performance electronics, which pushing the electronics industry to extend technology limits in terms of higher packaging density, lower cost, lighter weight, and greater performance. The materials related aspects in these fields are very crucial to extend the current limits.

This Special Issue selects excellent papers from EMPC 2017 that are related to materials development. The issue will cover the materials oriented scopes of advanced packaging and interconnects, electronic components assembly, printed, hybrid and flexible electronics, thermal management and functional systems. We invite investigators to contribute original research articles, as well as review articles, to this Special Issue.

Dr. Piotr Jasinski
Prof. Andrzej Dziedzic
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

Materials for advanced packaging and interconnects
Materials for electronic components assembly
Materials for printed, hybrid and flexible electronics
Materials for thermal management
Materials for functional systems.

Published Papers (3 papers)

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Research

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9 pages, 2274 KiB

Open AccessArticle

Thermoelectric Mixed Thick-/Thin Film Microgenerators Based on Constantan/Silver

by Mirosław Gierczak, Joanna Prażmowska-Czajka and Andrzej Dziedzic

Materials 2018, 11(1), 115; https://doi.org/10.3390/ma11010115 - 12 Jan 2018

Cited by 23 | Viewed by 4671

Abstract

This paper describes the design, manufacturing and characterization of newly developed mixed thick-/thin film thermoelectric microgenerators based on magnetron sputtered constantan (copper-nickel alloy) and screen-printed silver layers. The thermoelectric microgenerator consists of sixteen thermocouples made on a 34.2 × 27.5 × 0.25 mm³ alumina substrate. One of thermocouple arms was made of magnetron-sputtered constantan (Cu-Ni alloy), the second was a Ag-based screen-printed film. The length of each thermocouple arm was equal to 27 mm, and their width 0.3 mm. The distance between the arms was equal to 0.3 mm. In the first step, a pattern mask with thermocouples was designed and fabricated. Then, a constantan layer was magnetron sputtered over the whole substrate, and a photolithography process was used to prepare the first thermocouple arms. The second arms were screen-printed onto the substrate using a low-temperature silver paste (Heraeus C8829A or ElectroScience Laboratories ESL 599-E). To avoid oxidation of constantan, they were fired in a belt furnace in a nitrogen atmosphere at 550/450 °C peak firing temperature. Thermoelectric and electrical measurements were performed using the self-made measuring system. Two pyrometers included into the system were used for temperature measurement of hot and cold junctions. The estimated Seebeck coefficient, α was from the range 35 − 41 µV/K, whereas the total internal resistances R were between 250 and 3200 ohms, depending on magnetron sputtering time and kind of silver ink (the resistance of a single thermocouple was between 15.5 and 200 ohms). Full article

(This article belongs to the Special Issue Select Papers from the 21st European Microelectronics and Packaging Conference and Exhibition—EMPC 2017)

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7778 KiB

Open AccessFeature PaperArticle

Additively Manufactured Pneumatically Driven Skin Electrodes

by Martin Schubert, Martin Schmidt, Paul Wolter, Hagen Malberg, Sebastian Zaunseder and Karlheinz Bock

Materials 2018, 11(1), 19; https://doi.org/10.3390/ma11010019 - 23 Dec 2017

Cited by 3 | Viewed by 3562

Abstract

Telemedicine focuses on improving the quality of health care, particularly in out-of-hospital settings. One of the most important applications is the continuous remote monitoring of vital parameters. Long-term monitoring of biopotentials requires skin-electrodes. State-of-the-art electrodes such as Ag/AgCl wet electrodes lead, especially during long-term application, to complications, e.g., skin irritations. This paper presents a low-cost, on-demand electrode approach for future long-term applications. The fully printed module comprises a polymeric substrate with electrodes on a flexible membrane, which establishes skin contact only for short time in case of measurement. The membranes that produce airtight seals for pressure chambers can be pneumatically dilated and pressed onto the skin to ensure good contact, and subsequently retracted. The dilatation depends on the pressure and membrane thickness, which has been tested up to 150 kPa. The electrodes were fabricated in screen and inkjet printing technology, and compared during exemplary electrodermal activity measurement (EDA). The results show less amplitude compared to conventional EDA electrodes but similar behavior. Because of the manufacturing process the module enables high individuality for future applications. Full article

(This article belongs to the Special Issue Select Papers from the 21st European Microelectronics and Packaging Conference and Exhibition—EMPC 2017)

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Other

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12508 KiB

Open AccessFeature PaperProceeding Paper

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

by Jacob Maxa, Andrej Novikov and Mathias Nowottnick

Materials 2018, 11(1), 31; https://doi.org/10.3390/ma11010031 - 26 Dec 2017

Cited by 18 | Viewed by 5167

Abstract

Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs. Full article

(This article belongs to the Special Issue Select Papers from the 21st European Microelectronics and Packaging Conference and Exhibition—EMPC 2017)

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