Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
4.7
3.4
Journals
Micromachines
Special Issues
Heterogeneous Integration for Optical Micro and Nanosystems
share announcement

Heterogeneous Integration for Optical Micro and Nanosystems

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (15 January 2019) | Viewed by 29598

Special Issue Editor

Dr. Eiji Higurashi

E-Mail Website
Guest Editor
Department of Electronic Engineering, Tohoku University, Sendai 980-8579, Japan
Interests: heterogeneous Integration; microsystem integration; MEMS Packaging; low temperature bonding; optical MEMS and sensors

Special Issue Information

Dear Colleagues,

Over the last several decades, integrated photonics has been established as a promising technology for optoelectronic devices. Since all optical functionalities cannot be achieved by one material, heterogeneous integration of different materials is being explored. Heterogeneous integration technologies continue to advance due to rising demands for miniaturization, cost reduction, functional diversification, and increased performance in optical and photonic systems. Examples of fabricated devices include optoelectronic integrated circuits, optical MEMS, photonic crystals, photonic metamaterials, plasmonic devices. These devices are playing increasing roles in a wide range of applications, including sensor networks, Internet of Things, imaging, health-care, and other areas. The scope of this Special Issue of Micromachines is to highlight the continuous growth and advancement of the field of heterogeneous integration technologies for optical micro and nanosystems by soliciting original research papers, short communications, and review articles.

Prof. Dr. Eiji Higurashi
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Advanced fabrication technologies for optical micro and nanosystems
  • Wafer and die bonding
  • Flip-chip bonding
  • Monolithic and hybrid integration
  • Heterogeneous integration
  • 3D integration
  • Silicon optical benches
  • Silicon-on-insulator (SOI) platform
  • Mounting and micro-assembly
  • Passive and active alignment
  • Wafer level packaging
  • Hermetic sealing

Published Papers (5 papers)

Download All Papers
Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

10 pages, 4358 KiB  
Article
Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding
by Boyan Huang, Chenxi Wang, Hui Fang, Shicheng Zhou and Tadatomo Suga
Micromachines 2019, 10(5), 339; https://doi.org/10.3390/mi10050339 - 22 May 2019
Cited by 5 | Viewed by 5584
Abstract
High-precision aligned wafer bonding is essential to heterogeneous integration, with the device dimension reduced continuously. To get the alignment more accurately and conveniently, we propose a moiré-based alignment method using centrosymmetric grating marks. This method enables both coarse and fine alignment steps without [...] Read more.
High-precision aligned wafer bonding is essential to heterogeneous integration, with the device dimension reduced continuously. To get the alignment more accurately and conveniently, we propose a moiré-based alignment method using centrosymmetric grating marks. This method enables both coarse and fine alignment steps without requiring additional conventional cross-and-box alignment marks. Combined with an aligned wafer bonding system, alignment accuracy better than 300 nm (3σ) was achieved after bonding. Furthermore, the working principle of the moiré-based alignment for the backside alignment system was proposed to overcome the difficulty in bonding of opaque wafers. We believe this higher alignment accuracy is feasible to satisfy more demanding requirements in wafer-level stacking technologies. Full article
(This article belongs to the Special Issue Heterogeneous Integration for Optical Micro and Nanosystems)
►▼ Show Figures

Figure 1

22 pages, 10210 KiB  
Article
Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
by Sylwester Bargiel, Maciej Baranski, Maik Wiemer, Jörg Frömel, Wei-Shan Wang and Christophe Gorecki
Micromachines 2019, 10(3), 185; https://doi.org/10.3390/mi10030185 - 13 Mar 2019
Cited by 3 | Viewed by 4624
Abstract
We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where [...] Read more.
We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes. Full article
(This article belongs to the Special Issue Heterogeneous Integration for Optical Micro and Nanosystems)
►▼ Show Figures

Figure 1

8 pages, 2947 KiB  
Article
Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method
by Ryo Takigawa, Toru Tomimatsu, Eiji Higurashi and Tanemasa Asano
Micromachines 2019, 10(2), 136; https://doi.org/10.3390/mi10020136 - 18 Feb 2019
Cited by 16 | Viewed by 5933
Abstract
This paper focuses on the residual stress in a lithium niobate (LN) film layer of a LN-on-insulator (LNOI)/Si hybrid wafer. This stress originates from a large mismatch between the thermal expansion coefficients of the layers. A modified surface-activated bonding method achieved fabrication of [...] Read more.
This paper focuses on the residual stress in a lithium niobate (LN) film layer of a LN-on-insulator (LNOI)/Si hybrid wafer. This stress originates from a large mismatch between the thermal expansion coefficients of the layers. A modified surface-activated bonding method achieved fabrication of a thin-film LNOI/Si hybrid wafer. This low-temperature bonding method at 100 °C showed a strong bond between the LN and SiO2 layers, which is sufficient to withstand the wafer thinning to a LN thickness of approximately 5 μm using conventional mechanical polishing. Using micro-Raman spectroscopy, the residual stress in the bonded LN film in this trilayered (LN/SiO2/Si) structure was investigated. The measured residual tensile stress in the LN film layer was approximately 155 MPa, which was similar to the value calculated by stress analysis. This study will be useful for the development of various hetero-integrated LN micro-devices, including silicon-based, LNOI-integrated photonic devices. Full article
(This article belongs to the Special Issue Heterogeneous Integration for Optical Micro and Nanosystems)
►▼ Show Figures

Figure 1

12 pages, 3499 KiB  
Article
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films
by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh and Eiji Higurashi
Micromachines 2019, 10(2), 119; https://doi.org/10.3390/mi10020119 - 13 Feb 2019
Cited by 45 | Viewed by 8589
Abstract
Au–Au surface activated bonding is promising for room-temperature bonding. The use of Ar plasma vs. O2 plasma for pretreatment was investigated for room-temperature wafer-scale Au–Au bonding using ultrathin Au films (<50 nm) in ambient air. The main difference between Ar plasma and [...] Read more.
Au–Au surface activated bonding is promising for room-temperature bonding. The use of Ar plasma vs. O2 plasma for pretreatment was investigated for room-temperature wafer-scale Au–Au bonding using ultrathin Au films (<50 nm) in ambient air. The main difference between Ar plasma and O2 plasma is their surface activation mechanism: physical etching and chemical reaction, respectively. Destructive razor blade testing revealed that the bonding strength of samples obtained using Ar plasma treatment was higher than the strength of bulk Si (surface energy of bulk Si: 2.5 J/m2), while that of samples obtained using O2 plasma treatment was low (surface energy: 0.1–0.2 J/m2). X-ray photoelectron spectroscopy analysis revealed that a gold oxide (Au2O3) layer readily formed with O2 plasma treatment, and this layer impeded Au–Au bonding. Thermal desorption spectroscopy analysis revealed that Au2O3 thermally desorbed around 110 °C. Annealing of O2 plasma-treated samples up to 150 °C before bonding increased the bonding strength from 0.1 to 2.5 J/m2 due to Au2O3 decomposition. Full article
(This article belongs to the Special Issue Heterogeneous Integration for Optical Micro and Nanosystems)
►▼ Show Figures

Figure 1

8 pages, 2805 KiB  
Article
Design and Fabrication of a Three-Dimensional Artificial Compound Eye Using Two-Photon Polymerization
by Jieqiong Lin, Yudi Kan, Xian Jing and Mingming Lu
Micromachines 2018, 9(7), 336; https://doi.org/10.3390/mi9070336 - 02 Jul 2018
Cited by 16 | Viewed by 4276
Abstract
Microlens arrays have been widely used in the fields of micro-optics because of the advantages of their high diffraction efficiency, high fill factor, and wide operating band. However, the microlens array still has problems with its smaller field of view (FOV) and lower [...] Read more.
Microlens arrays have been widely used in the fields of micro-optics because of the advantages of their high diffraction efficiency, high fill factor, and wide operating band. However, the microlens array still has problems with its smaller field of view (FOV) and lower utilization of light energy. In this paper, a 3D compound eye system consisting of a microlens array and a pinhole array was designed according to the optical principle of insect compound eye. The artificial compound eye structure was processed in two-photon polymerization processing technology. Ray tracing and optical system simulation of the designed artificial compound eye structure were performed. The results showed that the artificial compound eye structure had a wider FOV and higher light energy utilization than a conventional 2D microlens array. This thesis may lay a theoretical foundation for the structural optimization design of microlens arrays. Full article
(This article belongs to the Special Issue Heterogeneous Integration for Optical Micro and Nanosystems)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-5
Back to TopTop