Special Issue "Technology and Applications of Carbon-Based MEMS"
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (31 October 2010)
Prof. Dr. Dean M. Aslam (Website)
Electrical and Computer Engineering Department, 2120 EB, Michigan State University, E. Lansing, MI 48824, USA
Fax: +1 517 353 1980
Interests: neural studies using microprobes; biochemical nanosensors; polycrystalline diamond (poly-C) sensors and MEMS (Bio; RF; Packaging); hands-on Lego-robotics modules for K-12; UG and graduate teaching
Among the known living systems, why is there none without carbon? This might be due carbon’s ability to offer three types of hybrid C-C bonds; sp3 (responsible for diamond lattice), sp2 (found in graphite and carbon nanotubes) and sp. An amorphous material called diamond like carbon (DLC) contains both sp3 and sp2 bonds. All carbon-based materials offer a unique (a) combination of properties and (b) range of structures not offered by any other known material. This makes them ideal materials for MEMS and NEMS. The challenge is to develop a technology of these materials for new applications not possible with existing materials. The research in the last 20 years has made a remarkable progress leading to BioMEMS, RFMEMS, MEMS packaging and carbon nanotube structures.
The special issue on ‘technology and applications of carbon-based MEMS’ is expected to bring cutting edge research on this subject in one volume for the first time. It will also be a useful resource for existing researchers, new researchers and all those who are interested in carbon’s remarkable current and potential applications.
Prof. Dr. Dean M. Aslam
Paper submission is requested in the following areas:
Technology: CVD diamond film fabrication for MEMS, dry etching, doping, novel multilayer structures, DLC films, carbon nanotubes (CNT), structures using diamond and CNT or diamond and DLC, nanocrystalline diamond (NCD).
Applications: Diamond-based MEMS, RFMEMS, BioMEMS, optical MEMS, MEMS packaging, radiation detectors, field emission devices, MOS transistors, microfluidics, CNT- & DLC-based MEMS/NEMS, BioMEMS, RFMEMS, NCD based structures.