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Polymers
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Packaging Films
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Packaging Films

A special issue of Polymers (ISSN 2073-4360).

Deadline for manuscript submissions: closed (31 March 2015) | Viewed by 39850

Special Issue Editor

Prof. Dr. Taek-Soo Kim

E-Mail Website
Guest Editor
Department of Mechanical Engineering, KAIST, Daejeon 305-701, Korea
Interests: mechanics-related subjects of advanced packaging and thin films: adhesion; deformation; fracture; fatigue; reliability; and stress/strain induced multiphysics phenomena

Special Issue Information

Dear Colleagues,

Packaging films are essential for maintaining the integrity of a variety of products, which range from foods to cutting-edge electronics, such as flexible OLED displays. In particular, the advent of flexible electronics requires further innovations in packaging films, including the development of the polymer flexible substrate. For example, in the case of flexible OLED displays, the rate of permeation for water must be lower than 10−6 g/m2/day; this is an extremely low penetration rate  (compared to other applications). Even the usage of graphene as the packaging film has to meet the ultimate requirements of permeability, flexibility, transparency, thickness, and stability. This Special Issue of Polymers will cover the whole line of recent research involved in advanced packaging film synthesis, integration, integrity tests, and more.

Prof. Dr. Taek-Soo Kim
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


Keywords

  • packaging films
  • polymer substrates
  • multilayer nanocomposite films
  • encapsulation
  • permeability
  • adhesion
  • flexible electronics

Published Papers (3 papers)

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Research

5045 KiB  
Article
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates
by Cheolgyu Kim, Tae-Ik Lee, Min Sung Kim and Taek-Soo Kim
Polymers 2015, 7(6), 985-1004; https://doi.org/10.3390/polym7060985 - 03 Jun 2015
Cited by 25 | Viewed by 14384
Abstract
This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The analysis method is performed using the following sequence: fabricate specimens for scanning 3D contours, transform 3D data into curvatures, [...] Read more.
This paper presents a warpage analysis method that predicts the warpage behavior of electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The analysis method is performed using the following sequence: fabricate specimens for scanning 3D contours, transform 3D data into curvatures, compute the built-in stress of the film using a stress-curvature analytic model, and verify it through comparisons of the finite element method (FEM) simulations with the measured data. The curvature is used to describe the deflection and warpage modes and orientations of the specimen. Two primary factors that affect the warpage behavior of the electroplated Cu film on FRP substrate specimens are investigated. The first factor is the built-in stress in a Cu film that explains the room temperature warpage of the specimen under no thermal process. The second factor is the misfit of the coefficient of thermal expansion (CTE) between the Cu and FRP layer, which is a dominant factor during the temperature change. The calculated residual stress, and predicted curvatures using FEM simulation throughout the reflow process temperature range between 25 and 180 °C are proven to be accurate by the comparison of the FEM simulations and experiment measurements. Full article
(This article belongs to the Special Issue Packaging Films)
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2094 KiB  
Article
Application of Humidity-Controlled Dynamic Mechanical Analysis (DMA-RH) to Moisture-Sensitive Edible Casein Films for Use in Food Packaging
by Laetitia M. Bonnaillie and Peggy M. Tomasula
Polymers 2015, 7(1), 91-114; https://doi.org/10.3390/polym7010091 - 06 Jan 2015
Cited by 19 | Viewed by 10268
Abstract
Protein-based and other hydrophilic thin films are promising materials for the manufacture of edible food packaging and other food and non-food applications. Calcium caseinate (CaCas) films are highly hygroscopic and physical characterization under broad environmental conditions is critical to application development and film [...] Read more.
Protein-based and other hydrophilic thin films are promising materials for the manufacture of edible food packaging and other food and non-food applications. Calcium caseinate (CaCas) films are highly hygroscopic and physical characterization under broad environmental conditions is critical to application development and film optimization. A new technology, humidity-controlled dynamic mechanical analysis (DMA-RH) was explored to characterize CaCas/glycerol films (3:1 ratio) during isohume temperature (T) ramps and steps, and isothermal RH ramps and steps, to determine their mechanical and moisture-sorption properties during extensive T and RH variations. When RH and/or T increased, CaCas/Gly films became strongly plasticized and underwent several primary and secondary humidity-dependent transition temperatures (or transition humidities); the CaCas/Gly network hypothetically rearranged itself to adapt to the increased water-content and heat-induced molecular mobility. Between 5–40 °C and 20%–61% RH, moisture-sorption was rapid and proportional to humidity between transition points and accelerated greatly during transitions. CaCas/Gly films seemed unsuitable for storage or utilization in warm/humid conditions as they lost their mechanical integrity around Tm ~ 40 °C at 50% RH and Tm decreased greatly with increased RH. However, below Tm, both moisture- and heat-induced structural changes in the films were fully reversible and casein films may withstand a variety of moderate abuse conditions. Full article
(This article belongs to the Special Issue Packaging Films)
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10548 KiB  
Article
Evaluation of the Thickness and Oxygen Transmission Rate before and after Thermoforming Mono- and Multi-layer Sheets into Trays with Variable Depth
by Mieke Buntinx, Gert Willems, Griet Knockaert, Dimitri Adons, Jan Yperman, Robert Carleer and Roos Peeters
Polymers 2014, 6(12), 3019-3043; https://doi.org/10.3390/polym6123019 - 22 Dec 2014
Cited by 35 | Viewed by 14320
Abstract
During thermoforming, plastic sheets are heated and subsequently deformed through the application of mechanical stretching and/or pressure. This process directly impacts sheet properties such as material thickness in walls, corners, and bottom, crystallinity in the constituent layers, and particularly the oxygen gas permeability. [...] Read more.
During thermoforming, plastic sheets are heated and subsequently deformed through the application of mechanical stretching and/or pressure. This process directly impacts sheet properties such as material thickness in walls, corners, and bottom, crystallinity in the constituent layers, and particularly the oxygen gas permeability. The aim of this study was to quantify the impact of thermoforming on thickness and oxygen transmission rate (OTR) of selected packaging materials (polypropylene (PP); PP/ethylene-vinyl alcohol co-polymer/PP (PP/EVOH/PP); polystyrene/EVOH/polyethylene (PS/EVOH/PE); amorphous polyethylene terephtalate/PE (APET/PE); APET/PE/EVOH/PE; polyamide/PE (PA/PE); and (PE/)PA/EVOH/PA/PE). These materials were extruded in two different thicknesses and thermoformed into trays with the same top dimensions and variable depths of 25, 50, and/or 75 mm and a 50 mm tray with a variable radius of the corners. The distribution of the material thickness in the trays was visualized, showing the locations that were most affected by the deep drawn process. The OTR results indicate that the calculated OTR, based on a homogeneous material distribution, can be used as a rough approximation of the measured OTR. However, detailed analysis of crystallization and unequal thinning, which is also related to the tray design, remains necessary to explain the deviation of the measured OTR as compared to the predicted one. Full article
(This article belongs to the Special Issue Packaging Films)
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