Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip
Abstract
:1. Introduction
2. Experimental
2.1. Materials Preparation and Microstructure
2.2. Quasi In Situ Slip Traces Analysis
3. Results
4. Discussion
4.1. Grain Rotation
4.2. Stored Energy
4.3. Slipping Behavior
4.4. Residual Stress
5. Conclusions
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Liu, Y.; Zhu, Q.; Zhou, Y.; Song, K.; Yang, X.; Chen, J. Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip. Metals 2024, 14, 491. https://doi.org/10.3390/met14050491
Liu Y, Zhu Q, Zhou Y, Song K, Yang X, Chen J. Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip. Metals. 2024; 14(5):491. https://doi.org/10.3390/met14050491
Chicago/Turabian StyleLiu, Yahui, Qianqian Zhu, Yanjun Zhou, Kexing Song, Xiaokang Yang, and Jing Chen. 2024. "Quasi In Situ Study on the Slipping Behavior and Residual Stress of Copper Strip" Metals 14, no. 5: 491. https://doi.org/10.3390/met14050491