Numerical Simulation and Optimization in Thermal Processes

A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Chemical Processes and Systems".

Deadline for manuscript submissions: 30 October 2024 | Viewed by 149

Special Issue Editors


E-Mail Website
Guest Editor
School of Safety Science and Engineering, Changzhou University, Changzhou 213164, China
Interests: thermokinetic; thermal analysis; thermal safety; thermal runaway; Li-ion battery safety; water mist; chemical engineering safety
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
College of Safety Science and Engineering, Nanjing Tech University, Nanjing 211816, China
Interests: thermal safety; thermal runaway assessment; gas/dust explosion prevention and control; quantitative risk assessment technology; hydrogen energy safety; synthesis and application of solid hydrogen storage materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Numerical simulation and optimization techniques have revolutionized the field of thermal processes, enabling engineers and researchers to analyze, design, and optimize complex thermal systems efficiently. This Special Issue explores the latest advancements in numerical simulation and optimization methods applied to thermal processes. From computational fluid dynamics (CFD) and finite element analysis (FEA) to multi-objective optimization algorithms and machine-learning-based approaches, researchers are continuously developing innovative methodologies to enhance thermal system performance. By accurately modeling heat transfer, fluid flow, and thermal behavior, engineers can optimize parameters, improve energy efficiency, and ensure safe operation.

This Special Issue aims to showcase the latest advancements in numerical simulation and optimization techniques applied to thermal processes. Whether your research focuses on computational fluid dynamics (CFD), finite element analysis (FEA), multi-objective optimization algorithms, or machine learning-based approaches, we encourage you to share your valuable insights and findings. By contributing to this Special Issue, you will contribute to the advancement of thermal processes, optimizing parameters, improving energy efficiency, and ensuring safe operation. We look forward to receiving your contributions and fostering meaningful discussions in this important field.

Dr. An-Chi Huang
Prof. Dr. Yun-Ting Tsai
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • numerical simulation
  • CFD
  • FEA
  • machine learning
  • thermal processes

Published Papers

This special issue is now open for submission.
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