Wang, Y.; Zhang, Y.; Hu, Z.; Li, J.; Gao, Z.; Wang, M.; Zhang, H.
Study on Graphene-Reinforced Epoxy Solvent-Borne High-Temperature-Resistant Adhesives for Bonding C/C Composites Under Extreme Temperatures. Materials 2025, 18, 4213.
https://doi.org/10.3390/ma18174213
AMA Style
Wang Y, Zhang Y, Hu Z, Li J, Gao Z, Wang M, Zhang H.
Study on Graphene-Reinforced Epoxy Solvent-Borne High-Temperature-Resistant Adhesives for Bonding C/C Composites Under Extreme Temperatures. Materials. 2025; 18(17):4213.
https://doi.org/10.3390/ma18174213
Chicago/Turabian Style
Wang, Yue, Yuqing Zhang, Zhanming Hu, Jingjing Li, Zhuo Gao, Mingchao Wang, and Haijun Zhang.
2025. "Study on Graphene-Reinforced Epoxy Solvent-Borne High-Temperature-Resistant Adhesives for Bonding C/C Composites Under Extreme Temperatures" Materials 18, no. 17: 4213.
https://doi.org/10.3390/ma18174213
APA Style
Wang, Y., Zhang, Y., Hu, Z., Li, J., Gao, Z., Wang, M., & Zhang, H.
(2025). Study on Graphene-Reinforced Epoxy Solvent-Borne High-Temperature-Resistant Adhesives for Bonding C/C Composites Under Extreme Temperatures. Materials, 18(17), 4213.
https://doi.org/10.3390/ma18174213