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Journal: Micromachines, 2019
Volume: 10
Number: 745
Article:
Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining
Authors:
by
Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen and Katsuaki Suganuma
Link:
https://www.mdpi.com/2072-666X/10/11/745
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