Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint
Abstract
:1. Introduction
2. Materials and Methods
3. Results
3.1. The Microstructure Evolution of Au-12Ge Solder Joint during Extreme Thermal Shock
3.2. Mechanical Properties of Au-12Ge Joints after Thermal Shock Test
4. Conclusions
- After soldering at 410 °C and dwelling for 2 min, the Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joint was dense and faultless. The interface layer was uniform, thin and continuous. The IMCs from the Au-12Ge solder to the Cu basal plate were NiGe and Ni5Ge3, respectively.
- The extreme thermal shock had slight effects on the interfacial layer thickness of the joints. Even after 400 cycles, the IMC layer was quite thin. As the experiment went on, partial NiGe IMC layer converted into Ni5Ge3 IMC layer, resulting in a planar NiGe layer. After 100 cycles, cracks were formed at the Ge phase due to the fragile nature and higher hardness of Ge. Cracks were detected at Ni5Ge3, NiGe layer and Ge phase after 400 cycles. The stress concentration caused by the superior temperature variation and the mismatch CTE of solder, interface layer and substrate led to formation and propagation of cracks.
- The solder joint after soldering was 50.9 MPa. The shear strength of solder joints subjected to thermal shock was in a minor degradation due to the generation of defects. The strengths were 47.8 MPa after 100 cycles, 40.2 MPa after 200 cycles, 35.1 MPa after 300 cycles, 29.5 MPa after 400 cycles, respectively. The fracture shifted from solder to the solder/NiGe interface and then to the IMC layer with the increasing number of cycles. The fracture mode transformed from ductile-brittle type to the brittle type.
Author Contributions
Funding
Acknowledgments
Conflicts of Interest
References
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Points | Composition, at.% | Phase | |
---|---|---|---|
Au | Ge | ||
A | 98.32 | 1.68 | Au |
B | 0 | 100.00 | Ge |
Points | Composition, at.% | Phase | |||
---|---|---|---|---|---|
Au | Ge | Ni | Cu | ||
A | - | 38.72 | 61.28 | - | Ni5Ge3 |
B | - | 100.00 | - | - | Ge |
C | - | 49.31 | 50.69 | - | NiGe |
D | 100.00 | - | - | - | Au |
E | - | - | 100.00 | - | Ni |
F | - | - | - | 100.00 | Cu |
Points | Composition, at.% | Phase | ||
---|---|---|---|---|
Au | Ge | Ni | ||
A | - | 100.00 | - | Ge |
B | - | 38.33 | 61.67 | Ni5Ge3 |
C | 0.30 | 50.63 | 49.07 | NiGe |
Points | Composition, at.% | Phase | ||
---|---|---|---|---|
Au | Ge | Ni | ||
A | 88.58 | 7.96 | 3.46 | Au |
B | 0.60 | 51.53 | 47.87 | NiGe |
C | - | 38.63 | 61.37 | Ni5Ge3 |
D | 1.83 | 47.51 | 50.67 | NiGe |
E | - | - | 100.00 | Ni |
F | - | 39.12 | 62.88 | Ni5Ge3 |
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Wang, Z.; Xue, S.; Long, W.; Wang, B.; Wang, J.; Zhang, P. Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint. Metals 2020, 10, 1373. https://doi.org/10.3390/met10101373
Wang Z, Xue S, Long W, Wang B, Wang J, Zhang P. Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint. Metals. 2020; 10(10):1373. https://doi.org/10.3390/met10101373
Chicago/Turabian StyleWang, Ziyi, Songbai Xue, Weimin Long, Bo Wang, Jianhao Wang, and Peng Zhang. 2020. "Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint" Metals 10, no. 10: 1373. https://doi.org/10.3390/met10101373