Reprint
MEMS Packaging Technologies and 3D Integration
Edited by
May 2022
210 pages
- ISBN978-3-0365-4258-4 (Hardback)
- ISBN978-3-0365-4257-7 (PDF)
This is a Reprint of the Special Issue MEMS Packaging Technologies and 3D Integration that was published in
Chemistry & Materials Science
Engineering
Physical Sciences
Summary
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.