Reprint
Mechanical Properties and Application of Adhesive Materials
Edited by
August 2024
224 pages
- ISBN978-3-7258-1702-3 (Hardback)
- ISBN978-3-7258-1701-6 (PDF)
This is a Reprint of the Special Issue Mechanical Properties and Application of Adhesive Materials that was published in
Chemistry & Materials Science
Engineering
Physical Sciences
Summary
Adhesive bonding is considered to be one of the key technologies for the development of many applications, including automotive, aerospace, medical, mechanical, civil, and light-weight transport applications, for a future with limited resources and increasing environmental concerns. Nowadays, there is no doubt that adhesive materials have penetrated many aspects of science and technology, from basic research to technological integration and industrial applications, rapidly progressing towards new discoveries.
Format
- Hardback
License and Copyright
© 2024 by the authors; CC BY-NC-ND license
Keywords
epoxy adhesives; adhesive joint; degradation; heat curing; thermal stability; resin hardener mix ratio; mathematical modelling; mechanical properties of adhesives; adhesive testing; adhesive joints; SRP; semi-analytic model; cyclic loading; pressure-sensitive adhesives; telomerization; bulk photopolymerization; polyacrylates; silicone acrylates; adhesive bonding; hydrothermal creep; degradation; creep fracture toughness; aging; adhesion modelling; cohesive interactions; cellulose model surfaces; fibre–fibre joints; adhesive bonding; damage; porosity; Kachanov–Sevostianov’s material; wooden joints; toughened joint; transverse strength; delamination; polyurethan bio-adhesives; boron acid; curing agents; epoxy resin composite; mechanical properties; thermal properties; flammability tests; adhesives; thermal aging; hygrothermal aging; durability; mechanical properties; epoxy adhesive; lap joint; fatigue strength; creep strength; temperature dependence