Reprint

Recent Advances in the Development of Thin Films

Edited by
August 2024
206 pages
  • ISBN978-3-7258-1855-6 (Hardback)
  • ISBN978-3-7258-1856-3 (PDF)
https://doi.org/10.3390/books978-3-7258-1856-3 (registering)

Print copies available soon

This book is a reprint of the Special Issue Recent Advances in the Development of Thin Films that was published in

Chemistry & Materials Science
Engineering
Summary

Thin-film coating technology has revolutionized various industries by offering functional solutions that enhance efficiency, flexibility, and performance in electronic devices, optics, solar cells, hard coatings, sensors, and even food preservation. This cutting-edge technology has significantly contributed to advancements in nanotechnology, materials science, and renewable energy. This Special Issue, comprising thirteen high-quality contributions, showcases a portion of the ongoing dynamism and diversity within thin-film research. It covers several key areas related to recent advancements in thin-film development, including deposition and characterization techniques, mechanical and electrical properties, sensing and solar cell technologies, food preservation and advanced approaches for assessing the mechanical behavior of thin films. The presented research reflects not only the current state-of-the-art but also offers new perspectives for future advancements across various industries and technologies.

Format
  • Hardback
License and Copyright
© 2024 by the authors; CC BY-NC-ND license
Keywords
Thin films; coating technologies; solar cells; semiconductors; magnetron sputtering; reactive sputtering; sol-gel thin films; CVD multi-coatings; MOCVD; edible coatings; food safety; electronic devices, optical properties; mechanical properties; characterization techniques; dielectric properties; fiber sensors; deposition methods; composite materials; ferrites; perovskites; organic semiconductors; doping; tin oxide; nitride gallium; microwave permeability; mixing rules; machine learning; multiphysics properties; nanoindentation; hardness; mechanical behavior; creep; elastoplastic; finite element simulation