3.2.1. Fabrication of Micropatterned Molds

3D structures were created by optical lithography of epoxy-based photoresist on silicon wafers, obtaining 115 μm thick molds. Designs included patterns of 50 μm, 100 μm, 200 μm, and 400 μm. Figure 4 shows a microscope image (BX 51, Olympus) of a chip with 200 μm structures.

**Figure 4.** Microscope images of micropatterned mold.
