*2.5. Fabrication of Micropatterned Molds*

Master mold layouts were designed using L-EditTM from Tanner EDA and printed on polyester-based film using a 3600 DPI printer. Molds were then created on silicon wafers by spin-coating SU8 2000 negative photoresist (10 s at 500 rpm and 30 s at 3000 rpm, Microchem Inc., Westborough, MA, USA). Wafers were previously cleaned with the standard piranha solution. The coated wafers were then soft-baked on a hot plate for 20 min at 65 ◦C, followed by 25 min at 95 ◦C, before exposing the photoresist through the photomask. Near UV (365 nm) was applied with an exposure dose of 650 mJ/cm<sup>2</sup> (EVG 620, EV Group). Post exposure bake conditions were 5 min at 65 ◦C, followed by 10 min at 95 ◦C. Molds were finished by 10 min of immersion on the developer (MicroChem's SU-8 Developer) with strong agitation, rinsed with isopropyl alcohol, and dried with nitrogen stream.
