*2.5. Engineering Effort*

The engineering effort and associated costs for the electrical installation should be minimized, leading to a lower overall system cost and a low threshold for architects to employ BIPV in their designs.

In BAPV, the engineering effort is already very low due to the standardization in panel sizes (standard 60 or 72 cells), the smaller system size, and the fact that cabling can be easily routed behind the panels.

A high degree of standardization and modularity in BIPV systems will reduce the engineering effort required to design the electrical system. Reference [43] already indicated that preinstalled MLCs in the BIPV modules are a promising solution to decrease costs. By doing so, all modules can be placed in parallel to a common bus structure. The different rated powers become a nonissue when a MLC is used, and the cabling from one module to the next can be preinstalled.
