**Myunghoi Kim**

Department of Electrical, Electronic, and Control Engineering, and the Institute for Information Technology Convergence, Hankyong National University, Anseong 17579, Korea; mhkim80@hknu.ac.kr

Received: 11 January 2019; Accepted: 1 March 2019; Published: 7 March 2019

**Abstract:** An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. Analytical expressions for the four-port impedance matrix of the CGP-EBG MTM-DTL are derived using coupled-line theory and a segmentation method. Converting the impedance matrix into mixed-mode scattering parameters enables obtaining common-mode noise suppression and differential signal transmission characteristics. The comprehensive evaluations of the CGP-EBG MTM-DTL using the proposed analytical model are also reported, which is validated by comparing mixed-mode scattering parameters *S*cc21 and *S*dd21 with those obtained from full-wave simulations and measurements. The proposed analytical model provides a drastic reduction of computation time and accurate results compared to full-wave simulation.

**Keywords:** common-mode noise; corrugated ground plane; differential signaling; electromagnetic bandgap; metamaterial; stepped impedance
