Reprint

Applications in Electronics Pervading Industry, Environment and Society

Sensing Systems and Pervasive Intelligence

Edited by
June 2021
258 pages
  • ISBN978-3-0365-0478-0 (Hardback)
  • ISBN978-3-0365-0479-7 (PDF)

This book is a reprint of the Special Issue Applications in Electronics Pervading Industry, Environment and Society – Sensing Systems and Pervasive Intelligence that was published in

Chemistry & Materials Science
Engineering
Environmental & Earth Sciences
Summary
This book features the manuscripts accepted for the Special Issue “Applications in Electronics Pervading Industry, Environment and Society—Sensing Systems and Pervasive Intelligence” of the MDPI journal Sensors. Most of the papers come from a selection of the best papers of the 2019 edition of the “Applications in Electronics Pervading Industry, Environment and Society” (APPLEPIES) Conference, which was held in November 2019. All these papers have been significantly enhanced with novel experimental results. The papers give an overview of the trends in research and development activities concerning the pervasive application of electronics in industry, the environment, and society. The focus of these papers is on cyber physical systems (CPS), with research proposals for new sensor acquisition and ADC (analog to digital converter) methods, high-speed communication systems, cybersecurity, big data management, and data processing including emerging machine learning techniques. Physical implementation aspects are discussed as well as the trade-off found between functional performance and hardware/system costs.
Format
  • Hardback
License
© 2022 by the authors; CC BY-NC-ND license
Keywords
model-based design; FPGA; HDL code generation; wearable sensors; embedded devices; face recognition; face verification; biometric sensors; deep learning; distillation; convolutional neural networks; spatial transformer network; video coding; discrete cosine transform; directional transform; VLSI; alternative representations to float numbers; posit arithmetic; Deep Neural Networks (DNNs); neural network activation functions; surface electromyography; event-driven; functional electrical stimulation; embedded system; resampling; interpolating polynomial; polyphase filter; digital circuit design; FPGA; ASIC; bitmap indexing; processing in memory; memory wall; big data; internet of things; intelligent sensors; autonomous driving; cyber security; HW accelerator; on-chip random number generator (RNG); SHA2; FPGA; ASIC standard-cell; machine learning; edge computing; embedded devices; edge analytics; ANN; k-NN; SVM; decision trees; ARM; X-Cube-AI; STM32 Nucleo; rad-hard; PLL (phase-locked loop); SEE (single event effects); Spacefibre; TID (total ionization dose); charge pump; phase/frequency detector; frequency divider; ring oscillator; LC-tank oscillator; SpaceFibre; rad-hard circuits; radiation effects; high-speed data transfer; support attitude; inertial measurement unit; coal mining; unscented Kalman filter; quaternion; gradient descent; research data collection and sharing; connected and automated driving; deployment and field testing; vehicular sensors; impact assessment; knowledge management; collaborative project methodology; n/a