**MEMS Packaging Technologies and 3D Integration**

Editor

**Seonho Seok**

MDPI Basel Beijing Wuhan Barcelona Belgrade Manchester Tokyo Cluj Tianjin

*Editor* Seonho Seok C2N (Center for Nanosciences and Nanotechnologies) University-Paris-Saclay Palaiseau France

*Editorial Office* MDPI St. Alban-Anlage 66 4052 Basel, Switzerland

This is a reprint of articles from the Special Issue published online in the open access journal *Micromachines* (ISSN 2072-666X) (available at: www.mdpi.com/journal/micromachines/special issues/MEMS Packaging Integration).

For citation purposes, cite each article independently as indicated on the article page online and as indicated below:

LastName, A.A.; LastName, B.B.; LastName, C.C. Article Title. *Journal Name* **Year**, *Volume Number*, Page Range.

**ISBN 978-3-0365-4258-4 (Hbk) ISBN 978-3-0365-4257-7 (PDF)**

Cover image courtesy of Hyungdal Park

© 2022 by the authors. Articles in this book are Open Access and distributed under the Creative Commons Attribution (CC BY) license, which allows users to download, copy and build upon published articles, as long as the author and publisher are properly credited, which ensures maximum dissemination and a wider impact of our publications.

The book as a whole is distributed by MDPI under the terms and conditions of the Creative Commons license CC BY-NC-ND.
