**Dipesh Kapoor 1, Cher Ming Tan 1,2,3,4,\* and Vivek Sangwan <sup>5</sup>**


Received: 4 December 2019; Accepted: 16 January 2020; Published: 21 January 2020

**Featured Application: Three-dimensional integrated circuit (3D-IC) is the trend for future C development because of its small form factor, high performance, low cost, and heterogeneous integration in system-in-package technologies. Several issues associated with 3D-IC besides their fabrication processes are being addressed, such as heat dissipation and so on, however, the electromagnetic interference between stacks has not been considered. In view of the high operating frequency, high power requirements of today IC, and together with the decreasing separation between the stacked dies, investigation on the subject matter is necessary, as they will soon become important. Unfortunately, the study of electromagnetic interference (EMI) within 3D-IC is di**ffi**cult from the measurement, as elaborated in this paper. In this work, we develop a simulation methodology and show the importance of EMI evaluation for 3D-IC, and we also illustrate the presence of minimum separation between the stacked dies for the avoidance of EMI.**

**Abstract:** Advancements in the functionalities and operating frequencies of integrated circuits (IC) have led to the necessity of measuring their electromagnetic Interference (EMI). Three-dimensional integrated circuit (3D-IC) represents the current advancements for multi-functionalities, high speed, high performance, and low-power IC technology. While the thermal challenges of 3D-IC have been studied extensively, the influence of EMI among the stacked dies has not been investigated. With the decreasing spacing between the stacked dies, this EMI can become more severe. This work demonstrates the potential of EMI within a 3D-IC numerically, and determines the minimum distance between stack dies to reduce the impact of EMI from one another before they are fabricated. The limitations of using near field measurement for the EMI study in stacked dies 3D-IC are also illustrated.

**Keywords:** 3D-IC (three-dimensional integrated circuit); electromagnetic interference; near field measurement
