2.3.3. Thermogravimetric Analysis (TGA)

The thermal stability of the Bi-MIPs, Bi-NIPs, Si-MIPs and Si-NIPs was determined by thermogravimetric analysis (TGA) (STA449F5, NETZSCH-Gerätebau GmbH, Selb, Germany). The samples were heated from 30 to 800 ◦C for thermal degradation under nitrogen protection at a rate of 10 ◦C/min [40].
