*5.1. Process Parameters*

In practice, regulating process parameters has emerged as a critical topic of study in reducing spatter effects during L-PBF. Process parameters such as (VED), scanning strategy, and build chamber pressures can affect the generation of spatter as follows: (1) Adopting a large spot combined with a low volume energy density can increase the depth of the melt

pool and effectively suppress spatter. (2) The Bessel beam can be employed to stabilize the melt pool and reduce the generation of spatter. (3) The pre-sintering and re-coating printing strategy can reduce spatter generation. (4) Adding helium to the protective gas, reducing its oxygen content, and increasing the build chamber pressure can reduce spatter generation. A summary of studies on the control of L-PBF process parameters to reduce spatter generation during processing is shown in Table 9.


**Table 9.** Summary of studies on the regulation of process parameters.
