**Contents**


Reprinted from: *Micromachines* **2023**, *14*, 304, doi:10.3390/mi14020304 ................ **111**

**Hongliang Zhou, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li and Andong Chang et al.**

Research Progress on Bonding Wire for Microelectronic Packaging Reprinted from: *Micromachines* **2023**, *14*, 432, doi:10.3390/mi14020432 ................ **127**
