*2.5. Chip Making*

The microfluidic chip was fabricated using a conventional soft-lithography process. First, the photosensitive film was used to make a mask according to the structure drawn by AutoCAD2021, and the photosensitive film was covered on the copper plate to make the thickness reach 100 μm as the layer height of the channel. Then, ultraviolet lithography was used to expose the photosensitive film and a developing solution was used to develop it, so that only the punch of the microfluidic chip was left on the copper plate. Then, the outer mold was used to fix the channel chip range, and then the polydimethylsiloxane (PDMS)

was poured into the mold. It was then put into a 70◦ oven to cure for 4 h, and finally the mold was taken out of the cured chip, and a plasma bonder was used to bond the chip and the glass slide to form a microfluidic chip. The physical map is shown in Figure 3.

**Figure 3.** Chip physical map.
