Reprint

Flexible Electronics

Fabrication and Ubiquitous Integration

Edited by
May 2019
160 pages
  • ISBN978-3-03897-828-2 (Paperback)
  • ISBN978-3-03897-829-9 (PDF)

This is a Reprint of the Special Issue Flexible Electronics: Fabrication and Ubiquitous Integration that was published in

Chemistry & Materials Science
Engineering
Physical Sciences
Summary
Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.
Format
  • Paperback
License and Copyright
© 2019 by the authors; CC BY-NC-ND license
Keywords
epidermal electronics; wearable heater; temperature sensor; feedback control; droplet circuits; liquid metal; quantum tunneling effect; solution electronics; electron transport; ionic conduction; quantum computing; brain-like intelligence; flexible organic electronics; artificial synapses; neuromorphic computing; long-term plasticity; flexible electronics; nano-fabrication; top-down approaches; bottom-up approaches; variable optical attenuator (VOA); surface plasmon-polariton (SPP); microwave photonics; stretchability; electronic measurements; stretchable circuits; design metrics; reliability; island-bridge; conformal design; non-developable surface; stretchable electronics; epidermal sensors; stretchable electronics; wireless power; hydrophobic paper; wearable stimulators; paper electronics; low-cost manufacture; stretchable electronics; tunnel encapsulation; Polyvinyl Alcohol; durability; bio-integrated devices; tissue adhesives; tunable adhesion; dry/wet conditions; soft biological tissue; n/a

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