Reprint

Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II

Edited by
July 2024
146 pages
  • ISBN978-3-7258-1546-3 (Hardback)
  • ISBN978-3-7258-1545-6 (PDF)

This book is a reprint of the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II that was published in

Chemistry & Materials Science
Engineering
Physical Sciences
Summary

Microelectromechanical systems (MEMS) are microdevices or systems that integrate microsensors, microconverters, microactuators, micromechanical structures, and micropower sources. MEMS devices have a wide range of applications in biomedical, automotive, aerospace, and communications fields, among various others. The design, optimization, performance, and application of the devices are crucial to the development of modern technology. In terms of design, MEMS devices need to overcome various challenges, such as size constraints, material selection, and manufacturing processes, to achieve high integration and miniaturization. Optimizing the design and performance of MEMS devices is of great significance for improving system efficiency, reducing costs, and enhancing functionality, and it is one of the current research hotspots. The performance of MEMS devices involves sensitivity, stability, power consumption, and other aspects to meet the requirements of various applications. This Special Issue explores key issues in the design, optimization, performance, and application of MEMS devices in order to provide a reference for research and development in related fields.

Format
  • Hardback
License and Copyright
© 2024 by the authors; CC BY-NC-ND license
Keywords
skin friction sensor; 3D models; CFD; turbulent flow; laminar flow; friction measurement accuracy; thin film thermocouples; temperature; anneal; complementary split ring resonator; metamaterial-based sensor; quality factor; multi-crack detection; higher-mode substrate-integrated waveguide; acoustofluidics; acousto-optic effect; SAW chip; PSO; BP neural network; NSGA-II; MEMS HRG; hemispherical resonant gyro; common-mode feedback; micro-capacitor detection; low noise; thin-film type; heat flow sensor; thermal resistance layer; thermopile; finite element simulation; graphene fibers; vitamin C; thermoelectric; flexible temperature sensors; MEMS; pressure sensor; wind effect; altitude estimation; microelectromechanical system; electrochemical angular accelerometer; rotational sensor; silicon-based four-electrode structure; n/a