Additive Manufacturing of Copper-Based Alloys
A special issue of Journal of Manufacturing and Materials Processing (ISSN 2504-4494).
Deadline for manuscript submissions: 31 January 2025 | Viewed by 120
Special Issue Editor
Interests: additive manufacturing of metallic materials; process development; material characterization
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Metal additive manufacturing (AM) has become a critical facet of the global advanced manufacturing enterprise. Commercialized applications for metal AM continue to emerge in many different sectors and involve a steadily broadening range of alloy systems. Copper-rich alloys feature prominently in this regard due to useful traits that include high electrical conductivity, exceptional strength, and outstanding corrosion resistance depending on the alloy system in question. This Special Issue seeks to publish fundamental and applied research related to the AM of these materials. Focal areas of interest include (but are not limited to) the following:
- Production of feedstock materials for copper AM processing;
- Copper alloy development for AM;
- Processing of conventional copper alloy chemistries using AM;
- Directed energy deposition of copper-rich alloys;
- Laser powder bed fusion of copper-rich alloys;
- Binder jet printing of copper-rich alloys;
- Wire arc additive manufacturing of copper-rich alloys;
- Properties of copper alloys processed through AM;
- Use of non-conventional approaches and/or energy sources in the AM of copper alloys;
- Effects of secondary operations on copper AM products;
- Commercialized applications for copper AM products.
Prof. Dr. Paul Bishop
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Manufacturing and Materials Processing is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- copper
- copper alloys
- additive manufacturing
- alloy development
- material characterization
- secondary operations
- commercial applications
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.