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Surface Functionalization Processes for New Multifunctional Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: closed (10 August 2022) | Viewed by 6224

Special Issue Editor


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Guest Editor
Institute of Materials for Electronics and Magnetism, National Research Council, IMEM-CNR, Trento Unit, I-38123 Trento, Italy
Interests: thin film growth; in-vacuum synthesis/deposition techniques; interface analysis; photoelectron spectroscopies; electron microscopies; nanostructured materials; low-dimensional materials

Special Issue Information

Dear Colleagues,

The ability to control, modify and tune surface chemical and physical properties of materials is extremely important when specific functionalities are sought. For example, achieving biocompatibility of surfaces (polymers, inorganics) with interesting structural, mechanical features but not enabling the interaction with organic tissues is one of the most intriguing challenges for the realization of prostheses and probes. The functionalization of inorganic nanostructured materials is highly appealing for biosensing, drug delivery, bioimaging, theranostics, and is also a promising approach for water treatment and environmental bioremediation. Finally, organic monolayers can tune the electronic properties of metals and semiconductors for the realization of advanced electronic and optoelectronic devices.

The common goal is to modify the surface properties by adding specific chemical groups or nanostructures, typically a very thin film (from submonolayer to one or few layers), to achieve new features, towards a new class of advanced multifunctional materials for applications in sensing, electronics, and biomedicals.

Several approaches can be used to achieve these goals, having in mind that a stable bond between the surface and organic groups or nanoparticles must often be achieved to improve the stability and reliability of the new hybrid materials. Wet chemistry, which is probably the most used and versatile approach to functionalizing inorganic surfaces with organic molecules and also inorganic nanoparticles, the self-assembled monolayer created by Langmuir–Blodgett, electrodeposition, and organic deposition in a vacuum are all reliable methods for testing and defining new approaches.

This Special Issue will explore the most promising techniques and materials that focus on surface functionalization, to integrate different properties towards multifunctionality. A multidisciplinary approach is intrinsic in these research fields, starting from a base knowledge of materials to chemical/physical interactions at the interfaces, characterization tools to study such properties, and their reliability for the final application. Thus, all these points will be considered and discussed.

Dr. Roberto Verucchi
Guest Editor

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • surface functionalization
  • multifunctional materials
  • organic molecules
  • nanostructured materials
  • biocompatibility
  • sensing and biosensing

Published Papers (2 papers)

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Research

18 pages, 9140 KiB  
Article
Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish
by Panwang Chi, Yesu Li, Hongfa Pan, Yibo Wang, Nancheng Chen, Ming Li and Liming Gao
Materials 2021, 14(24), 7874; https://doi.org/10.3390/ma14247874 - 19 Dec 2021
Cited by 4 | Viewed by 3398
Abstract
Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high [...] Read more.
Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high impedance and weldability. In this paper, the interfacial reaction process between ultrathin ENEPIG substrates with different Ni layer thicknesses (0.112 and 0.185 μm) and Sn–3.0Ag–0.5Cu (SAC305) solder during reflow and aging was studied. The bonding ability and reliability of solder joints with different surface finishes were evaluated based on solder ball shear test, drop test and temperature cycle test (TCT), and the failure mechanism was analyzed from the perspective of intermetallic compound (IMC) interface growth. The results showed that the Ni–Sn–P layer generated by ultrathin ENEPIG can inhibit the growth of brittle IMC so that the solder joints maintain high shear strength. Ultrathin ENEPIG with a Ni layer thickness of 0.185 μm had no failure cracks under thermal cycling and drop impact, which can meet actual reliability standards. Therefore, ultrathin ENEPIG has broad prospects and important significance in the field of high-frequency chip substrate design and manufacturing. Full article
(This article belongs to the Special Issue Surface Functionalization Processes for New Multifunctional Materials)
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11 pages, 2458 KiB  
Article
Black TiOx Films with Photothermal-Assisted Photocatalytic Activity Prepared by Reactive Sputtering
by Quan Mao, Meng Liu, Yajie Li, Yuquan Wei, Yong Yang and Zhengren Huang
Materials 2021, 14(10), 2508; https://doi.org/10.3390/ma14102508 - 12 May 2021
Cited by 6 | Viewed by 2229
Abstract
Titanium oxide is widely applied as a photocatalyst. However, its low efficiency and narrow light absorption range are two main disadvantages that severely impede its practical application. In this work, black TiOx films with different chemical compositions were fabricated by tuning target [...] Read more.
Titanium oxide is widely applied as a photocatalyst. However, its low efficiency and narrow light absorption range are two main disadvantages that severely impede its practical application. In this work, black TiOx films with different chemical compositions were fabricated by tuning target voltage and controlling O2 flow during reactive DC magnetron sputtering. The optimized TiOx films with mixed phases (TiO, Ti2O3, Ti3O5, and TiO2) exhibited fantastic photothermal and photocatalytic activity by combining high light-absorptive Ti2O3 and Ti3O5 phases with the photocatalytic TiO2 phase. The sample prepared with oxygen flow at 5.6 ± 0.2 sccm and target voltage near 400 V exhibited excellent optical absorbance of 89.29% under visible light, which could improve surface temperature to 114 °C under sunlight. This film could degrade Rhodamine-B up to 74% after 150 min of UV irradiation. In a word, this work provides a guideline for fabricating black TiOx films with photothermal-assisted photocatalytic activity by reactive DC magnetron sputtering, which could avoid the usage of hydrogen and is convenient for quantity preparation. Full article
(This article belongs to the Special Issue Surface Functionalization Processes for New Multifunctional Materials)
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