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52 pages, 28425 KiB  
Review
Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)
by Takayuki Ohba, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson and Norio Chujo
Electronics 2022, 11(2), 236; https://doi.org/10.3390/electronics11020236 - 12 Jan 2022
Cited by 13 | Viewed by 11933
Abstract
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects between wafers and between chips and wafers are a second-generation alternative to the use of micro-bumps for WOW and COW technologies. WOW and COW [...] Read more.
Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects between wafers and between chips and wafers are a second-generation alternative to the use of micro-bumps for WOW and COW technologies. WOW and COW technologies for BBCube can be used for homogeneous and heterogeneous 3DI, respectively. Ultra-thinning of wafers down to 4 μm offers the advantage of a small form factor, not only in terms of the total volume of 3D ICs, but also the aspect ratio of Through-Silicon-Vias (TSVs). Bumpless interconnect technology can increase the number of TSVs per chip due to the finer TSV pitch and the lower impedance of bumpless TSV interconnects. In addition, high-density TSV interconnects with a short length provide the highest thermal dissipation from high-temperature devices such as CPUs and GPUs. This paper describes the process platform for BBCube WOW and COW technologies and BBCube DRAMs with high speed and low IO buffer power by enhancing parallelism and increasing yield by using a vertically replaceable memory block architecture, and also presents a comparison of thermal characteristics in 3D structures constructed with micro-bumps and BBCube. Full article
(This article belongs to the Special Issue High-Density Solid-State Memory Devices and Technologies)
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