Latest Technologies in the Additive Manufacturing of Flexible and Printable Electronics

Dear Colleagues,

Flexible and printable electronics technologies in additive manufacturing have offered a new way of synthesizing printable materials and devices for fabrication purposes. The Special Issue will showcase cutting-edge research studies that refine a scientific understanding relevant for printable and flexible electronics while striving towards low-cost ecofriendly materials and devices that can potentially transform the field of microelectronics by disrupting the entire chain, from design to manufacturing to application.

Among the different additive manufacturing technologies, those based on flexible electronics technologies represent a strong and intensive research effort in both industry and academia, leading to the publication of many scientific papers over the last few years. This huge interest has resulted in this Special Issue which offers researchers in this area the opportunity to publish their research work through research papers or review papers.

The topics of interest covered by this Special Issue include, but are not limited to, the following:

• Printing fabrication and methods;
• Curing and sintering processing techniques;
• Advanced manufacturing technologies;
• Flexible hybrid electronics (FHE);
• The assembly or packaging of conventional electronics on flexible substrates;
• The heterogenous integration of printed elements onto conventional electronics;
• Sensors and devices, and their related properties;
• Disposable and sustainable materials and substrates;
• Stretchable and flexible materials and devices;
• The characterization and testing of printable materials and devices;
• The design and simulation of printable materials and devices;
• End-user applications, such as OLED, OPV and solar cells, RFID and antennas, touch surfaces, wearable and smart textiles, smart patches, health monitoring and biosensors, anti-counterfeit solutions, temperature and pressure sensors, thermoelectric and energy storage/harvesting, sensors, smart packaging, EV batteries, and many others.

Prof. Dr. Martin Bolduc
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• flexible and printed electronics
• additive manufacturing
• printable materials and devices
• disposable and functional materials
• flexible hybrid electronics
• flexible and printable sensors