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Journal: Sensors, 2014
Volume: 14
Number: 20533

Article: A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology
Authors: by Junjie Wu, Lihua Lei, Xin Chen, Xiaoyu Cai, Yuan Li and Tao Han
Link: https://www.mdpi.com/1424-8220/14/11/20533

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