Monitoring Lower Back Activity in Daily Life Using Small Unintrusive Sensors and Wearable Electronics in the Context of Rheumatic and Musculoskeletal Diseases
Abstract
:1. Introduction
- Diagnosis: Lower back pain can be induced by multiple risk factors. It is complex to measure the posture and movement adopted by the patient during his daily and working life (for example, posture and movement while lifting heavy loads, posture while sitting on a chair, repeated movement in a factory, etc.). It is indeed not trivial for a physician to measure the posture of a patient when the patient is not in a medical facility. Moreover, there could be a need to conduct the measurement over long periods (several days or weeks).
- Therapy: While pain can usually be symptomatically treated by medication, bad posture habits cannot. It usually takes time to turn bad habits into good habits. It is then critical for the therapist to have a mean to help the patient after the diagnosis which can require weeks and months of real-time monitoring and real-time notification to help the patient to learn new good habits about their postures and movements. As demonstrated by [3], home training of a patient is more effective when using sensor-based feedback than using a simple mirror or no feedback.
2. Materials and Methods
- Unit 1 is intended to acquire the muscles activity via two surface electromyography (sEMG) measurement circuits. One on the left and one on the right side of the body.
- Unit 2 comprises a 6-DoF IMU measuring linear accelerations and rotation speeds in three axes each to estimate the position and orientation of the subject of interest.
- Unit 3 is the main electronic unit composed of processing, communication and power management.
2.1. Surface Electromyography Sensor
2.2. Inertial Sensor
2.3. Main Unit
2.4. Wireless Communication
2.5. Sensor System Fabrication
- The central area, placed on the spine, was designed to be as thin as possible while maintaining a reasonable surface. It contains the CPU, the IMU, a crystal, and few passive components with the following respective thicknesses: 400 µm, 910 µm, 650 µm, and 350 µm. This brings a final theoretical PCB thickness of 996 µm with a surface of 9.65 mm × 7.82 mm (without antenna). Despite the fact that we used a zeroth-order resonator (ZOR) antenna measuring only 8.97 mm × 6.27 mm, connecting the antenna next to the PCB would have almost doubled its size. As a tradeoff between size, thickness, and emission performance, it was decided to stack the antenna onto the PCB providing a final sensor measuring 9.65 mm × 7.82 mm × 1.09 mm. Figure 6 shows photos of the PCB, the antenna, and the result when the two PCBs are stacked. The left part of the PCB containing the 4-pin headers is meant to be cut once the CPU is programmed and the prototype is ready to be used.
- The two decentralized parts, placed a few centimeters from the center of the back and on the side, were designed to be as compact as possible. They were designed symmetric from each other. Each part contained an INA, an OPA, and few passive components having the following respective thicknesses: 750 µm, 950 µm, and 250 µm. Since the battery was the biggest element measuring 3.6 mm in thickness, it was decided to split the sEMG acquisition circuit into two PCBs and stack them to reduce its footprint. This resulted in two stacked circuits with a footprint of 25 mm2 instead of 43 mm2 and a thickness of 1.872 mm instead of 0.996 mm. The final area including the battery measured 9.45 mm × 7.27 mm × 3.6 mm. Figure 7 shows pictures of the two layers and the combined parts with the battery.
2.6. Packaging and Connection
- An acrylonitrile butadiene styrene (ABS) mold with the desired shape was created using 3D printing technology (Figure 8a). ABS was selected over polylactic acid (PLA) for its higher glass transition temperature which is around 105 °C despite its higher complexity to 3D print;
- A first layer of PDMS was deposited onto the bottom of the mold. This prevented a contact between sensors and mold and thus an incomplete sealing (Figure 8b);
- Once the first layer was cured, the sensor system was placed and maintained in position while a second layer of PDMS was added. This layer was used to fix the sensors in its final position and to prevent them from moving during the final step (Figure 8c,d). Special care was taken to prevent the sensors from touching the mold and create a failure in the sealing;
- Once the second layer was cured and the PCB fixed in the correct position, the mold was fully filled with PDMS (Figure 8e);
- The packaged sensors were removed from the mold (Figure 8f).
3. Results
3.1. Surface Electromyography Sensor
3.2. Inertial Sensors
3.3. Long-Term Measurement
3.4. Packaging and Connection
3.5. Communication
4. Discussion
4.1. Surface Electromyography Sensor
4.2. Inertial Sensors
4.3. Long-Term Measurement
4.4. Packaging and Connection
4.5. Communication
5. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Properties | Accelerometer | Gyroscope |
---|---|---|
Resolution (x, y, z) | 14 bits | 16 bits |
Bandwidth | 125 Hz | 100 Hz |
Range | ±16 g | 2000 dps |
Noise | 70 µg/√Hz | 3.8 mdps/√Hz |
Packet Size (Bytes) | ||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Update Frequency [Hz] | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 20 | 30 | 40 | 50 | 60 | 70 | 80 | 90 | 100 | 200 | 300 | 400 | 500 | |
1 | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 20 | 30 | 40 | 50 | 60 | 70 | 80 | 90 | 100 | 200 | 300 | 400 | 0 | |
2 | 2 | 4 | 6 | 8 | 10 | 12 | 14 | 16 | 18 | 20 | 40 | 60 | 80 | 100 | 120 | 140 | 160 | 180 | 200 | 400 | 600 | 800 | 0 | |
3 | 3 | 6 | 9 | 12 | 15 | 18 | 21 | 24 | 27 | 30 | 60 | 90 | 120 | 150 | 180 | 210 | 240 | 270 | 300 | 600 | 900 | 1200 | 0 | |
4 | 4 | 8 | 12 | 16 | 20 | 24 | 28 | 32 | 36 | 40 | 80 | 120 | 160 | 200 | 240 | 280 | 320 | 360 | 400 | 800 | 1200 | 0 | 0 | |
5 | 5 | 10 | 15 | 20 | 25 | 30 | 35 | 40 | 45 | 50 | 100 | 150 | 200 | 250 | 300 | 350 | 400 | 450 | 500 | 1000 | 1500 | 0 | 0 | |
6 | 6 | 12 | 18 | 24 | 30 | 36 | 42 | 48 | 54 | 60 | 120 | 180 | 240 | 300 | 360 | 420 | 480 | 540 | 600 | 1200 | 1800 | 0 | 0 | |
7 | 7 | 14 | 21 | 28 | 35 | 42 | 49 | 56 | 63 | 70 | 140 | 210 | 280 | 350 | 420 | 490 | 560 | 630 | 700 | 1400 | 2100 | 0 | 0 | |
8 | 8 | 16 | 24 | 32 | 40 | 48 | 56 | 64 | 72 | 80 | 160 | 240 | 320 | 400 | 480 | 560 | 640 | 720 | 800 | 1600 | 0 | 0 | 0 | |
9 | 9 | 18 | 27 | 36 | 45 | 54 | 63 | 72 | 81 | 90 | 180 | 270 | 360 | 450 | 540 | 630 | 720 | 810 | 900 | 1800 | 0 | 0 | 0 | |
10 | 10 | 20 | 30 | 40 | 50 | 60 | 70 | 80 | 90 | 100 | 200 | 300 | 400 | 500 | 600 | 700 | 800 | 900 | 1000 | 2000 | 0 | 0 | 0 | |
20 | 20 | 40 | 60 | 80 | 100 | 120 | 140 | 160 | 180 | 200 | 400 | 600 | 800 | 1000 | 1200 | 1400 | 1600 | 1800 | 2000 | 0 | 0 | 0 | 0 | |
30 | 30 | 60 | 90 | 120 | 150 | 180 | 210 | 240 | 270 | 300 | 600 | 900 | 1200 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
40 | 40 | 80 | 120 | 160 | 200 | 240 | 280 | 320 | 360 | 400 | 800 | 1200 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
50 | 50 | 100 | 150 | 200 | 250 | 300 | 350 | 400 | 450 | 500 | 1000 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
60 | 60 | 120 | 180 | 240 | 300 | 360 | 420 | 480 | 540 | 600 | 1200 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
70 | 70 | 140 | 210 | 280 | 350 | 420 | 490 | 560 | 630 | 700 | 1400 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
80 | 80 | 160 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | |
90 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
This Work (IMU) | Shimmer [4] | FreeMG [9] | Brunelli et al. [15] | Trigno [16] | |
---|---|---|---|---|---|
Length [mm] | 11.65 | 65 | 41.5 | 27 | 27 |
Height [mm] | 9.27 | 32 | 24.8 | 18 | 37 |
Thickness [mm] | 5.6 | 12 | 14 | 9.2 | 13 |
Number of channels | 1 | 2 | 1 | 32 | 1 |
Resolution [bit] | 10 | NA | 16 | 12 | 16 |
Max sample rate [Hz] | 1000 | 8400 | 1000 | 1000 | 4370 |
Weight [g] | 0.5 | 31 | 13 | NA | 7 |
Packaging | Soft PDMS | Rigid plastic | Rigid plastic | NA | Rigid plastic |
This Work (EMG) | LPMS-B2 [7] | Valero et al. [11] | Trigno [16] | Lee et al. [19] | |
---|---|---|---|---|---|
Length [mm] | 11.45 | 39 | 60 | 27 | 40 |
Height [mm] | 9.82 | 39 | 40 | 37 | 37 |
Thickness [mm] | 3.1 | 8 | 15 | 13 | NA |
DOF | 6 | 9 | NA | 6 | 6 |
Resolution [bit] | 10 | NA | NA | 16 | 16 |
Max sample rate [Hz] | 100 | 400 | 50 | 963/741 | 100 |
Weight [g] | 0.9 (each) | 12 | NA | 10 | NA |
Packaging | Soft PDMS | Rigid plastic | Rigid plastic | Rigid plastic | Adhesive film |
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Baijot, M.; Puers, R.; Kraft, M. Monitoring Lower Back Activity in Daily Life Using Small Unintrusive Sensors and Wearable Electronics in the Context of Rheumatic and Musculoskeletal Diseases. Sensors 2021, 21, 6362. https://doi.org/10.3390/s21196362
Baijot M, Puers R, Kraft M. Monitoring Lower Back Activity in Daily Life Using Small Unintrusive Sensors and Wearable Electronics in the Context of Rheumatic and Musculoskeletal Diseases. Sensors. 2021; 21(19):6362. https://doi.org/10.3390/s21196362
Chicago/Turabian StyleBaijot, Mathieu, Robert Puers, and Michael Kraft. 2021. "Monitoring Lower Back Activity in Daily Life Using Small Unintrusive Sensors and Wearable Electronics in the Context of Rheumatic and Musculoskeletal Diseases" Sensors 21, no. 19: 6362. https://doi.org/10.3390/s21196362
APA StyleBaijot, M., Puers, R., & Kraft, M. (2021). Monitoring Lower Back Activity in Daily Life Using Small Unintrusive Sensors and Wearable Electronics in the Context of Rheumatic and Musculoskeletal Diseases. Sensors, 21(19), 6362. https://doi.org/10.3390/s21196362