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Journal: Sensors, 2008
Volume: 8
Number: 7438

Article: Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer
Authors: by Azrul Azlan Hamzah, Jumril Yunas, Burhanuddin Yeop Majlis and Ibrahim Ahmad
Link: https://www.mdpi.com/1424-8220/8/11/7438

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