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Journal: Micromachines, 2019
Volume: 10
Number: 160

Article: High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
Authors: by Kang Wu, Qifeng Zhou, Huaping Zou, Kangmin Leng, Yifan Zeng and Zhigang Wu
Link: https://www.mdpi.com/2072-666X/10/3/160

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