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Journal: Micromachines, 2019
Volume: 10
Number: 160
Article:
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
Authors:
by
Kang Wu, Qifeng Zhou, Huaping Zou, Kangmin Leng, Yifan Zeng and Zhigang Wu
Link:
https://www.mdpi.com/2072-666X/10/3/160
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