Polishing of Silicon Nitride Ceramic Balls by Clustered Magnetorheological Finish
Round 1
Reviewer 1 Report
The authors have presented a paper where they use CMRF for the polishing of ceramic spherical parts. The paper is interesting, however, some revisions are required.
First of all, the authors should rephrase or elaborate more on the sentences regarding the novelty of their paper; it is not connected to a novel process but rather to a novel application.
The authors have investigated some of the parameters of the process but they have not dealt with others. For example, how were the components of the slurry selected? Why at these quantities? Why are these kept constant? Please, be more specific. Furthermore, how was the spectrum of the selected parameters decided? Are there any recommendations or is it an arbitrary selection of the values of Table 3? Please, again, be more specific.
The rest of the analysis, both experimental and modeling, are interesting.
Author Response
Please see the attachment.
Author Response File: 
Author Response.docx
Reviewer 2 Report
A very thorough analysis of the polishing of ceramic spheres. Quite excellent work.
Author Response
The authors greatly appreciate the comments on the acknowledgement of the effort on our research.
