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Journal: Micromachines, 2020
Volume: 11
Number: 454

Article: Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding
Authors: by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Seiichi Takamatsu, Toshihiro Itoh and Eiji Higurashi
Link: https://www.mdpi.com/2072-666X/11/5/454

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