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Journal: Micromachines, 2021
Volume: 12
Number: 1165

Article: Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices
Authors: by Yanan Yu, Yafei Yin, Yuhang Li, Min Li and Jizhou Song
Link: https://www.mdpi.com/2072-666X/12/10/1165

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