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Journal: Micromachines, 2021
Volume: 12
Number: 542
Article:
Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)
Authors:
by
Michael S. Gerlt, Nino F. Läubli, Michel Manser, Bradley J. Nelson and Jürg Dual
Link:
https://www.mdpi.com/2072-666X/12/5/542
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