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Journal: Micromachines, 2021
Volume: 12
Number: 599

Article: Silicon Wafer Etching Rate Characteristics with Burst Width Using 150 kHz Band High-Power Burst Inductively Coupled Plasma
Authors: by Hisaki Kikuchi, Katsuyuki Takahashi, Seiji Mukaigawa, Koichi Takaki and Ken Yukimura
Link: https://www.mdpi.com/2072-666X/12/6/599

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