Order Article Reprints

Wang Z, He C, Zhang W, Li Y, Gao P, Meng Y, Zhang G, Yang Y, Wang R, Cui J, et al. Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. Micromachines. 2022; 13(1):99. https://doi.org/10.3390/mi13010099

Wang, Ziyuan, Changde He, Wendong Zhang, Yifan Li, Pengfei Gao, Yanan Meng, Guojun Zhang, Yuhua Yang, Renxin Wang, Jiangong Cui, and et al. 2022. "Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding" Micromachines 13, no. 1: 99. https://doi.org/10.3390/mi13010099

Wang, Z., He, C., Zhang, W., Li, Y., Gao, P., Meng, Y., Zhang, G., Yang, Y., Wang, R., Cui, J., Wang, H., Zhang, B., Ren, Y., Zhen, G., Jiao, X., & Zhang, S. (2022). Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. Micromachines, 13(1), 99. https://doi.org/10.3390/mi13010099