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Journal: Micromachines, 2022
Volume: 13
Number: 99
Article:
Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding
Authors:
by
Ziyuan Wang, Changde He, Wendong Zhang, Yifan Li, Pengfei Gao, Yanan Meng, Guojun Zhang, Yuhua Yang, Renxin Wang, Jiangong Cui, Hongliang Wang, Binzhen Zhang, Yongfeng Ren, Guoyong Zhen, Xinquan Jiao and Sai Zhang
Link:
https://www.mdpi.com/2072-666X/13/1/99
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