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Journal: Micromachines, 2022
Volume: 13
Number: 1976

Article: Multi-Band Power Amplifier Module with Back-Off Efficiency Improvement using Ultra-Compact 3D Vertical Stack Multi-Chip Package for Cellular Handsets
Authors: by Zhihao Zhang, Jing Li, Lin Peng and Bo Sun
Link: https://www.mdpi.com/2072-666X/13/11/1976

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