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Article
Peer-Review Record

Experimental and Numerical Investigation of the Die Swell in 3D Printing Processes

Micromachines 2023, 14(2), 329; https://doi.org/10.3390/mi14020329
by Stefano De Rosa, Daniele Tammaro and Gaetano D’Avino *
Reviewer 1:
Reviewer 2: Anonymous
Micromachines 2023, 14(2), 329; https://doi.org/10.3390/mi14020329
Submission received: 11 January 2023 / Revised: 20 January 2023 / Accepted: 21 January 2023 / Published: 27 January 2023
(This article belongs to the Special Issue 3D Printed Micro-/Nano Devices)

Round 1

Reviewer 1 Report

Dear Authors,

I find Your paper very interesting and very well written, and I don't have any comments. Congratulations on Your good work.

Regards!

Author Response

We thank the Reviewer for his/her positive evaluation of the paper.

Reviewer 2 Report

The current manuscript is well presented and shows interesting results. So, it would be advisable to publish it after the following minor advisors:

1. Add some results to the abstract

2. Please add labels a,b,c, etc on figures (for example figure3, figure 4, etc)  with multiple images

3. Redo the sentences in personal, for example: we found, we assume etc

4. A discussion section should be added after the results section

 

5. The future prospects are not presented, please add a sentence at the end of the manuscript.

Author Response

See attachment.

Author Response File: Author Response.pdf

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