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Journal: Micromachines, 2023
Volume: 14
Number: 1568

Article: Structural Design and Simulation of a Multi-Channel and Dual Working Condition Wafer Defect Inspection Prototype
Authors: by Ruizhe Ding, Haiyan Luo, Zhiwei Li, Zuoda Zhou, Dingjun Qu and Wei Xiong
Link: https://www.mdpi.com/2072-666X/14/8/1568

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