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Journal: Micromachines, 2024
Volume: 15
Number: 801
Article:
Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications
Authors:
by
Tim Scherzer, Marius Wolf, Kai Werum, Holger Ruckdäschel, Wolfgang Eberhardt and André Zimmermann
Link:
https://www.mdpi.com/2072-666X/15/6/801
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