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Journal: Micromachines, 2024
Volume: 15
Number: 801

Article: Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications
Authors: by Tim Scherzer, Marius Wolf, Kai Werum, Holger Ruckdäschel, Wolfgang Eberhardt and André Zimmermann
Link: https://www.mdpi.com/2072-666X/15/6/801

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