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Journal: Micromachines, 2017
Volume: 8
Number: 158

Article: Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers
Authors: by Dongling Li, Zhengguo Shang, Yin She and Zhiyu Wen
Link: https://www.mdpi.com/2072-666X/8/5/158

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