Guo, T.; Tai, X.; Wei, S.; Wang, J.; Jia, Z.; Ding, Y.
Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment. Crystals 2020, 10, 207.
https://doi.org/10.3390/cryst10030207
AMA Style
Guo T, Tai X, Wei S, Wang J, Jia Z, Ding Y.
Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment. Crystals. 2020; 10(3):207.
https://doi.org/10.3390/cryst10030207
Chicago/Turabian Style
Guo, Tingbiao, Xiaoyang Tai, Shiru Wei, Junjie Wang, Zhi Jia, and Yutian Ding.
2020. "Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment" Crystals 10, no. 3: 207.
https://doi.org/10.3390/cryst10030207
APA Style
Guo, T., Tai, X., Wei, S., Wang, J., Jia, Z., & Ding, Y.
(2020). Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment. Crystals, 10(3), 207.
https://doi.org/10.3390/cryst10030207