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Journal: Metals, 2020
Volume: 10
Number: 1223
Article:
Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices
Authors:
by
Guoqian Mu, Wenqing Qu, Haiyun Zhu, Hongshou Zhuang and Yanhua Zhang
Link:
https://www.mdpi.com/2075-4701/10/9/1223
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