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Journal: Metals, 2021
Volume: 11
Number: 538
Article:
Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders
Authors:
by
Yan Zhi Peng, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu and Jian Hong Yi
Link:
https://www.mdpi.com/2075-4701/11/4/538
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