Temperature Resistance of Mo3Si: Phase Stability, Microhardness, and Creep Properties
Abstract
:1. Introduction
2. Materials and Methods
3. Results and Discussion
3.1. Microstructure
3.2. Microhardness
3.3. Constant Load Compressive Creep Tests
3.3.1. Experimental Results
3.3.2. Regression with Power Law with Constant Creep Exponent
3.3.3. Regression with Stress Range Dependent Constitutive Model
3.3.4. Regression with Power Law Using Temperature-Dependent Creep Exponent
4. Discussion on Creep Mechanism
- Regressions with (i) power law with constant creep exponent and with (ii) power law with temperature-dependent creep exponent
- regression with stress range dependent constitutive model.
4.1. Regressions with (i) Power Law with Constant Creep Exponent in Section 3.3.2 and with (ii) Power Law with Temperature-Dependent Creep Exponent in Section 3.3.4
4.2. Regression with Stress Range Dependent Constitutive Model in Section 3.3.3
5. Conclusions
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
Nomenclature and Abbreviations List
Abbreviations | |
BSE | backscattered electrons |
EDM | electrical discharge machining |
EDX | energy dispersive X-Ray |
SE | secondary electrons |
SEM | scanning electron microscope |
XRD | X-ray diffraction |
Latin Letters | |
A | material constant |
a | material constant |
B | material constant |
b | material constant |
c | material constant |
d | material constant |
E | Young modulus |
n | material constant |
Q | activation energy for the mechanism involved in the deformation process |
Qa | activation energy of linear creep |
Qb | activation energy of power law creep |
R | gas constant |
R-squared values | |
T | test temperature |
Tm | melting temperature |
Greek Letters | |
minimum creep rate | |
material constant | |
εp | pivot point creep rate |
σ | stress |
σ0 | material constant |
σp | pivot point stress |
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T | n | ||
---|---|---|---|
1093 °C | 4.6 | 5.08 × 10−21 | 0.878 |
1300 °C | 1.3 | 3.85 × 10−10 | 0.722 |
n | |||||
---|---|---|---|---|---|
7 | 2.68 × 1013 | 2129 | 590 | 19 | 0.981 |
13 | 1.77 × 1013 | 2364 | 577 | 17 | 0.998 |
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Kauss, O.; Obert, S.; Bogomol, I.; Wablat, T.; Siemensmeyer, N.; Naumenko, K.; Krüger, M. Temperature Resistance of Mo3Si: Phase Stability, Microhardness, and Creep Properties. Metals 2021, 11, 564. https://doi.org/10.3390/met11040564
Kauss O, Obert S, Bogomol I, Wablat T, Siemensmeyer N, Naumenko K, Krüger M. Temperature Resistance of Mo3Si: Phase Stability, Microhardness, and Creep Properties. Metals. 2021; 11(4):564. https://doi.org/10.3390/met11040564
Chicago/Turabian StyleKauss, Olha, Susanne Obert, Iurii Bogomol, Thomas Wablat, Nils Siemensmeyer, Konstantin Naumenko, and Manja Krüger. 2021. "Temperature Resistance of Mo3Si: Phase Stability, Microhardness, and Creep Properties" Metals 11, no. 4: 564. https://doi.org/10.3390/met11040564
APA StyleKauss, O., Obert, S., Bogomol, I., Wablat, T., Siemensmeyer, N., Naumenko, K., & Krüger, M. (2021). Temperature Resistance of Mo3Si: Phase Stability, Microhardness, and Creep Properties. Metals, 11(4), 564. https://doi.org/10.3390/met11040564