Next Article in Journal
Effects of Hot Isostatic Pressing and Heat Treatment on the Microstructure and Mechanical Properties of Cast TiAl Alloy
Previous Article in Journal
Inverse Identification of the Ductile Failure Law for Ti6Al4V Based on Orthogonal Cutting Experimental Outcomes
Previous Article in Special Issue
Nonisothermal Kinetic Degradation of Hybrid CNT/Alumina Epoxy Nanocomposites
 
 
Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
Journals
Metals
Volume 11
Issue 8
10.3390/met11081155
metals-logo
Submit to this Journal Review for this Journal Propose a Special Issue
► Article Menu

Article Menu

share Share announcement Help format_quote Cite question_answer Discuss in SciProfiles
first_page
settings
Order Article Reprints
Font Type:
Arial Georgia Verdana
Font Size:
Aa Aa Aa
Line Spacing:
Column Width:
Background:
Article

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

by
Muhammad Iqbal Ahmad
1,2,
Mohd Sharizal Abdul Aziz
1,*,
Mohd Zulkifly Abdullah
1,
Mohd Arif Anuar Mohd Salleh
3,
Mohammad Hafifi Hafiz Ishak
4,
Wan Rahiman
5 and
Marcin Nabiałek
6
1
School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia
2
Faculty of Bioengineering and Technology, Jeli Campus, Universiti Malaysia Kelantan, Jeli 17600, Kelantan, Malaysia
3
Center of Excellence Geopolymer and Green Technology (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Kangar 01000, Perlis, Malaysia
4
School of Aerospace Engineering, Engineering Campus, Nibong Tebal 14300, Penang, Malaysia
5
School of Electrical and Electronic Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia
6
Department of Physics, Faculty of Production Engineering and Materials Technology, Czestochowa University of Technology, 42-200 Czestochowa, Poland
*
Author to whom correspondence should be addressed.
Metals 2021, 11(8), 1155; https://doi.org/10.3390/met11081155
Submission received: 23 May 2021 / Revised: 28 June 2021 / Accepted: 17 July 2021 / Published: 21 July 2021
(This article belongs to the Special Issue Magnetization Process of Bulk and Classical Amorphous Alloys)
Browse Figures
Versions Notes

Abstract

This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.
Keywords: surface mount technology; FPCB; reflow soldering; computational fluid dynamics surface mount technology; FPCB; reflow soldering; computational fluid dynamics

Share and Cite

MDPI and ACS Style

Ahmad, M.I.; Abdul Aziz, M.S.; Abdullah, M.Z.; Salleh, M.A.A.M.; Ishak, M.H.H.; Rahiman, W.; Nabiałek, M. Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process. Metals 2021, 11, 1155. https://doi.org/10.3390/met11081155

AMA Style

Ahmad MI, Abdul Aziz MS, Abdullah MZ, Salleh MAAM, Ishak MHH, Rahiman W, Nabiałek M. Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process. Metals. 2021; 11(8):1155. https://doi.org/10.3390/met11081155

Chicago/Turabian Style

Ahmad, Muhammad Iqbal, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Mohd Arif Anuar Mohd Salleh, Mohammad Hafifi Hafiz Ishak, Wan Rahiman, and Marcin Nabiałek. 2021. "Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process" Metals 11, no. 8: 1155. https://doi.org/10.3390/met11081155

APA Style

Ahmad, M. I., Abdul Aziz, M. S., Abdullah, M. Z., Salleh, M. A. A. M., Ishak, M. H. H., Rahiman, W., & Nabiałek, M. (2021). Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process. Metals, 11(8), 1155. https://doi.org/10.3390/met11081155

Note that from the first issue of 2016, this journal uses article numbers instead of page numbers. See further details here.

Article Metrics

Back to TopTop